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GT8G103_06 PDF预览

GT8G103_06

更新时间: 2024-11-06 03:29:19
品牌 Logo 应用领域
东芝 - TOSHIBA 闪光灯
页数 文件大小 规格书
5页 408K
描述
STROBE FLASH APPLICATIONS

GT8G103_06 数据手册

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GT8G103  
TOSHIBA INSULATED GATE BIPOLAR TRANSISTOR SILICON N CHANNEL IGBT  
GT8G103  
STROBE FLASH APPLICATIONS  
z 3rd Generation  
Unit: mm  
(A)  
z EnhancementMode  
z Low Saturation Voltage: V  
= 8 V (Max.) (@I = 150 A)  
C
CE (sat)  
z 4.5 V Gate Drive  
ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)  
CHARACTERISTIC  
SYMBOL  
RATING  
UNIT  
CollectorEmitter Voltage  
V
V
V
400  
±6  
V
V
CES  
GES  
GES  
(B)  
DC  
GateEmitter Voltage  
Pulse  
DC  
±8  
V
I
8
A
C
Collector Current  
1 ms  
I
150  
1.3  
A
CP  
Ta = 25°C  
Tc = 25°C  
P
W
W
°C  
°C  
Collector Power  
Dissipation  
C
C
P
20  
Junction Temperature  
T
150  
55~150  
j
Storage Temperature Range  
T
stg  
Note: Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e. operating  
temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
JEDEC  
JEITA  
TOSHIBA (A) 2-7B5C (B) 2-7B6C  
Weight: 0.36 g (typ.)  
Please design the appropriate reliability upon reviewing the Toshiba  
Semiconductor Reliability Handbook (“Handling  
Precautions”/Derating Concept and Methods) and individual reliability  
data (i.e. reliability test report and estimated failure rate, etc).  
ELECTRICAL CHARACTERISTICS (Ta = 25°C)  
CHARACTERISTIC  
Gate Leakage Current  
SYMBOL  
TEST CONDITION  
MIN  
TYP.  
MAX  
UNIT  
I
V
V
= 6 V, V = 0  
0.5  
10  
10  
1.2  
8
μA  
μA  
V
GES  
GE  
CE  
CE  
Collector Cutoff Current  
GateEmitter Cutoff Voltage  
CollectorEmitter Saturation Voltage  
Input Capacitance  
I
= 400 V, V  
= 0  
GE  
CES  
V
I
I
= 1 mA, V  
= 5 V  
GE (OFF)  
C
C
CE  
V
= 150 A, V  
= 4.5 V (Pulsed)  
5
V
CE (sat)  
GE  
= 10 V, V = 0, f = 1 MHz  
GE  
C
V
1900  
1.2  
1.4  
1.8  
2.4  
pF  
ies  
CE  
Rise Time  
t
r
Turnon Time  
Switching Time  
t
on  
μs  
Fall Time  
t
f
Turnoff Time  
t
off  
Thermal Resistance  
R
th (jc)  
6.25 °C / W  
These devices are MOS type. Users should follow proper ESD Handling Procedures.  
Operating condition of turn-off dv / dt should be lower than 400 V / μs.  
1
2006-11-02  

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