GT8G103
TOSHIBA INSULATED GATE BIPOLAR TRANSISTOR SILICON N CHANNEL IGBT
GT8G103
STROBE FLASH APPLICATIONS
z 3rd Generation
Unit: mm
(A)
z Enhancement−Mode
z Low Saturation Voltage: V
= 8 V (Max.) (@I = 150 A)
C
CE (sat)
z 4.5 V Gate Drive
ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)
CHARACTERISTIC
SYMBOL
RATING
UNIT
Collector−Emitter Voltage
V
V
V
400
±6
V
V
CES
GES
GES
(B)
DC
Gate−Emitter Voltage
Pulse
DC
±8
V
I
8
A
C
Collector Current
1 ms
I
150
1.3
A
CP
Ta = 25°C
Tc = 25°C
P
W
W
°C
°C
Collector Power
Dissipation
C
C
P
20
Junction Temperature
T
150
−55~150
j
Storage Temperature Range
T
stg
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum
ratings.
JEDEC
JEITA
⎯
⎯
TOSHIBA (A) 2-7B5C (B) 2-7B6C
Weight: 0.36 g (typ.)
Please design the appropriate reliability upon reviewing the Toshiba
Semiconductor Reliability Handbook (“Handling
Precautions”/Derating Concept and Methods) and individual reliability
data (i.e. reliability test report and estimated failure rate, etc).
ELECTRICAL CHARACTERISTICS (Ta = 25°C)
CHARACTERISTIC
Gate Leakage Current
SYMBOL
TEST CONDITION
MIN
TYP.
MAX
UNIT
I
V
V
= 6 V, V = 0
―
―
0.5
―
―
―
―
―
―
―
―
―
10
10
1.2
8
μA
μA
V
GES
GE
CE
CE
Collector Cut−off Current
Gate−Emitter Cut−off Voltage
Collector−Emitter Saturation Voltage
Input Capacitance
I
= 400 V, V
= 0
GE
CES
V
I
I
= 1 mA, V
= 5 V
―
GE (OFF)
C
C
CE
V
= 150 A, V
= 4.5 V (Pulsed)
5
V
CE (sat)
GE
= 10 V, V = 0, f = 1 MHz
GE
C
V
1900
1.2
1.4
1.8
2.4
―
−
pF
ies
CE
Rise Time
t
―
―
―
―
r
Turn−on Time
Switching Time
t
on
μs
Fall Time
t
f
Turn−off Time
t
off
Thermal Resistance
R
th (j−c)
―
6.25 °C / W
These devices are MOS type. Users should follow proper ESD Handling Procedures.
Operating condition of turn-off dv / dt should be lower than 400 V / μs.
1
2006-11-02