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FQP1N60 PDF预览

FQP1N60

更新时间: 2024-11-20 22:27:35
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 522K
描述
QFET N-CHANNEL

FQP1N60 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TO-220AB包装说明:TO-220, 3 PIN
针数:3Reach Compliance Code:unknown
风险等级:5.42Is Samacsys:N
雪崩能效等级(Eas):50 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:600 V最大漏极电流 (Abs) (ID):1.2 A
最大漏极电流 (ID):1.2 A最大漏源导通电阻:11.5 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT APPLICABLE
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):40 W
最大脉冲漏极电流 (IDM):4.8 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT APPLICABLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FQP1N60 数据手册

 浏览型号FQP1N60的Datasheet PDF文件第2页浏览型号FQP1N60的Datasheet PDF文件第3页浏览型号FQP1N60的Datasheet PDF文件第4页浏览型号FQP1N60的Datasheet PDF文件第5页浏览型号FQP1N60的Datasheet PDF文件第6页浏览型号FQP1N60的Datasheet PDF文件第7页 
QFET N-CHANNEL  
FEATURES  
FQP1N60  
BV  
= 600V  
DSS  
Advanced New Design  
R
= 11.5Ω  
DS(ON)  
Avalanche Rugged Technology  
Rugged Gate Oxide Technology  
Very Low Intrinsic Capacitances  
Excellent Switching Characteristics  
Unrivalled Gate Charge: 5.0nC (Typ.)  
Extended Safe Operating Area  
I = 1.2A  
D
TO-220  
1
2
3
Lower R  
: 9.3(Typ.)  
DS(ON)  
1. Gate 2. Drain 3. Source  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Characteristics  
Drain-to-Source Voltage  
Continuous Drain Current (T = 25°C)  
Value  
600  
1.2  
Units  
V
V
DSS  
C
I
A
D
Continuous Drain Current (T = 100°C)  
0.76  
4.8  
C
I
Drain Current-Pulsed  
A
V
DM  
V
Gate-to-Source Voltage  
Single Pulsed Avalanche Energy  
Avalanche Current  
±30  
50  
GS  
AS  
AR  
E
mJ  
A
I
1.2  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
4.0  
mJ  
V/ns  
AR  
dv/dt  
4.5  
Total Power Dissipation (T = 25°C)  
Linear Derating Factor  
40  
0.32  
W
W/°C  
C
P
D
Operating Junction and Storage  
Temperature Range  
T , T  
55 to +150  
J
STG  
°C  
Maximum Lead Temp. for Soldering  
Purposes, 1/8” from case for 5-seconds  
T
300  
L
THERMAL RESISTANCE  
Symbol  
Characteristics  
Junction-to-Case  
Case-to-Sink  
Typ.  
Max.  
Units  
R
0.5  
3.13  
θJC  
R
°C/W  
θCS  
R
Junction-to-Ambient  
62.5  
θJA  
REV. B  
1
1999 Fairchild Semiconductor Corporation  

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