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FQU1N60C PDF预览

FQU1N60C

更新时间: 2024-11-20 22:18:27
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
9页 641K
描述
600V N-Channel MOSFET

FQU1N60C 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Transferred包装说明:IN-LINE, R-PSIP-T3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:5.35Is Samacsys:N
其他特性:AVALANCHE RATED, FAST SWITCHING雪崩能效等级(Eas):33 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:600 V
最大漏极电流 (Abs) (ID):1 A最大漏极电流 (ID):1 A
最大漏源导通电阻:11.5 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSIP-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):28 W最大脉冲漏极电流 (IDM):4 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:NOT SPECIFIED
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FQU1N60C 数据手册

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®
QFET  
FQD1N60C / FQU1N60C  
600V N-Channel MOSFET  
General Description  
Features  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary,  
planar stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switched mode power supplies,  
active power factor correction, electronic lamp ballasts  
based on half bridge topology.  
1A, 600V, R  
= 11.5@V = 10 V  
DS(on) GS  
Low gate charge ( typical 4.8nC)  
Low Crss ( typical 3.5 pF)  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
D
!
D
G!  
I-PAK  
FQU Series  
D-PAK  
FQD Series  
G
S
G D S  
!
S
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
FQD1N60C / FQU1N60C  
Units  
V
V
I
Drain-Source Voltage  
600  
DSS  
- Continuous (T = 25°C)  
Drain Current  
1
A
D
C
- Continuous (T = 100°C)  
0.6  
A
C
I
(Note 1)  
Drain Current  
- Pulsed  
4
A
DM  
V
E
I
Gate-Source Voltage  
± 30  
V
GSS  
AS  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
33  
mJ  
A
1
2.8  
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
mJ  
V/ns  
W
AR  
dv/dt  
4.5  
Power Dissipation (T = 25°C)*  
2.5  
A
P
Power Dissipation (T = 25°C)  
28  
W
D
C
- Derate above 25°C  
Operating and Storage Temperature Range  
0.22  
W/°C  
°C  
T , T  
-55 to +150  
J
STG  
Maximum lead temperature for soldering purposes,  
T
300  
°C  
L
1/8" from case for 5 seconds  
Thermal Characteristics  
Symbol  
Parameter  
Typ  
--  
Max  
4.53  
50  
Units  
°C/W  
°C/W  
°C/W  
R
R
R
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient*  
Thermal Resistance, Junction-to-Ambient  
θJC  
θJA  
θJA  
--  
--  
110  
* When mounted on the minimum pad size recommended (PCB Mount)  
©2003 Fairchild Semiconductor Corporation  
Rev. A, November 2003  

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