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FQI11N40C PDF预览

FQI11N40C

更新时间: 2024-11-03 21:55:15
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
9页 623K
描述
400V N-Channel MOSFET

FQI11N40C 技术参数

生命周期:Obsolete包装说明:IN-LINE, R-PSIP-T3
针数:3Reach Compliance Code:unknown
风险等级:5.84其他特性:FAST SWITCHING
雪崩能效等级(Eas):360 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:400 V最大漏极电流 (Abs) (ID):10.5 A
最大漏极电流 (ID):10.5 A最大漏源导通电阻:0.53 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):135 W最大脉冲漏极电流 (IDM):42 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FQI11N40C 数据手册

 浏览型号FQI11N40C的Datasheet PDF文件第2页浏览型号FQI11N40C的Datasheet PDF文件第3页浏览型号FQI11N40C的Datasheet PDF文件第4页浏览型号FQI11N40C的Datasheet PDF文件第5页浏览型号FQI11N40C的Datasheet PDF文件第6页浏览型号FQI11N40C的Datasheet PDF文件第7页 
®
QFET  
FQB11N40C/FQI11N40C  
400V N-Channel MOSFET  
General Description  
Features  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary,  
planar stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switched mode power supplies,  
active power factor correction, electronic lamp ballasts  
based on half bridge topology.  
10.5 A, 400V, R  
=
0.5 @V = 10 V  
GS  
DS(on)  
Low gate charge ( typical 28 nC)  
Low Crss ( typical 85pF)  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
D
!
D
"
! "  
I2-PAK  
FQI Series  
"
"
D2-PAK  
FQB Series  
!
G
G
S
G D S  
!
S
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
FQB11N40C / FQI11N40C  
Units  
V
V
I
Drain-Source Voltage  
400  
10.5  
6.6  
DSS  
- Continuous (T = 25°C)  
Drain Current  
A
D
C
- Continuous (T = 100°C)  
A
C
I
(Note 1)  
Drain Current  
- Pulsed  
42  
A
DM  
V
E
I
Gate-Source Voltage  
± 30  
360  
V
GSS  
AS  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
11  
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
13.5  
4.5  
mJ  
V/ns  
W
AR  
dv/dt  
P
Power Dissipation (T = 25°C)  
135  
D
C
- Derate above 25°C  
Operating and Storage Temperature Range  
1.07  
-55 to +150  
W/°C  
°C  
T , T  
J
STG  
Maximum lead temperature for soldering purposes,  
T
300  
°C  
L
1/8" from case for 5 seconds  
Thermal Characteristics  
Symbol  
Parameter  
Typ  
Max  
0.93  
40  
Units  
°C/W  
°C/W  
°C/W  
R
R
R
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient *  
Thermal Resistance, Junction-to-Ambient  
-
-
-
θJC  
θJA  
θJA  
62.5  
* When mounted on the minimum pad size recommended (PCB Mount)  
©2004 Fairchild Semiconductor Corporation  
Rev. A, January 2004  

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