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FQI13N50C PDF预览

FQI13N50C

更新时间: 2024-11-03 22:14:31
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
9页 648K
描述
500V N-Channel MOSFET

FQI13N50C 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred包装说明:IN-LINE, R-PSIP-T3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:5.7其他特性:FAST SWITCHING
雪崩能效等级(Eas):860 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:500 V最大漏极电流 (Abs) (ID):13 A
最大漏极电流 (ID):13 A最大漏源导通电阻:0.48 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):195 W
最大脉冲漏极电流 (IDM):52 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FQI13N50C 数据手册

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TM  
QFET  
FQB13N50C/FQI13N50C  
500V N-Channel MOSFET  
General Description  
Features  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary,  
planar stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switched mode power supplies,  
active power factor correction, electronic lamp ballasts  
based on half bridge topology.  
13A, 500V, R  
= 0.48@V = 10 V  
DS(on) GS  
Low gate charge ( typical 43nC)  
Low Crss ( typical 20pF)  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
D
!
D
"
! "  
"
"
!
G
I2-PAK  
D2-PAK  
FQB Series  
G
S
FQI Series  
!
S
G D S  
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
FQB13N50C / FQI13N50C  
Units  
V
V
I
Drain-Source Voltage  
500  
13  
DSS  
- Continuous (T = 25°C)  
Drain Current  
A
D
C
- Continuous (T = 100°C)  
8
A
C
I
(Note 1)  
Drain Current  
- Pulsed  
52  
A
DM  
V
E
I
Gate-Source Voltage  
± 30  
860  
V
GSS  
AS  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
13  
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
19.5  
4.5  
mJ  
V/ns  
W
AR  
dv/dt  
P
Power Dissipation (T = 25°C)  
195  
D
C
- Derate above 25°C  
Operating and Storage Temperature Range  
1.56  
-55 to +150  
W/°C  
°C  
T , T  
J
STG  
Maximum lead temperature for soldering purposes,  
T
300  
°C  
L
1/8" from case for 5 seconds  
Thermal Characteristics  
Symbol  
Parameter  
Typ  
--  
Max  
0.64  
40  
Units  
°C/W  
°C/W  
°C/W  
R
R
R
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient *  
Thermal Resistance, Junction-to-Ambient  
θJC  
θJA  
θJA  
--  
--  
62.5  
* When mounted on the minium pad size recommended (PCB Mount).  
©2003 Fairchild Semiconductor Corporation  
Rev. A, October 2003  

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