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FQB5N50CFTM PDF预览

FQB5N50CFTM

更新时间: 2024-11-02 03:37:39
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
8页 701K
描述
500V N-Channel MOSFET

FQB5N50CFTM 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:D2PAK包装说明:SMALL OUTLINE, R-PSSO-G2
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:5.29雪崩能效等级(Eas):300 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:500 V最大漏极电流 (Abs) (ID):5 A
最大漏极电流 (ID):5 A最大漏源导通电阻:1.55 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):96 W
最大脉冲漏极电流 (IDM):20 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子形式:GULL WING端子位置:SINGLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FQB5N50CFTM 数据手册

 浏览型号FQB5N50CFTM的Datasheet PDF文件第2页浏览型号FQB5N50CFTM的Datasheet PDF文件第3页浏览型号FQB5N50CFTM的Datasheet PDF文件第4页浏览型号FQB5N50CFTM的Datasheet PDF文件第5页浏览型号FQB5N50CFTM的Datasheet PDF文件第6页浏览型号FQB5N50CFTM的Datasheet PDF文件第7页 
May 2006  
TM  
FRFET  
FQB5N50CF  
500V N-Channel MOSFET  
Features  
Description  
5A, 500V, RDS(on)  
=
1.55 @VGS = 10 V  
These N-Channel enhancement mode power field effect transis-  
tors are produced using Fairchild’s proprietary, planar stripe,  
DMOS technology.  
Low gate charge ( typical 18nC)  
Low Crss ( typical 15pF)  
Fast switching  
This advanced technology has been especially tailored to mini-  
mize on-state resistance, provide superior switching perfor-  
mance, and withstand high energy pulse in the avalanche and  
commutation mode. These devices are well suited for high effi-  
ciency switched mode power supplies, electronic lamp ballasts  
based on half bridge topology.  
100% avalanche tested  
Improved dv/dt capability  
D
D
G
D2-PAK  
G
S
FQB Series  
S
Absolute Maximum Ratings  
Symbol  
Parameter  
FQB5N50CF  
Units  
V
VDSS  
ID  
Drain-Source Voltage  
500  
Drain Current  
- Continuous (TC = 25°C)  
- Continuous (TC = 100°C)  
- Pulsed  
5
3.2  
A
A
(Note 1)  
IDM  
Drain Current  
20  
A
VGSS  
EAS  
IAR  
Gate-Source Voltage  
± 30  
300  
V
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
5
EAR  
dv/dt  
PD  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Power Dissipation (TC = 25°C)  
9.6  
mJ  
V/ns  
W
4.5  
96  
- Derate above 25°C  
0.76  
-55 to +150  
W/°C  
°C  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
Maximum lead temperature for soldering purposes,  
1/8" from case for 5 seconds  
300  
°C  
Thermal Characteristics  
Symbol  
Parameter  
FQB5N50CF  
Units  
°C/W  
°C/W  
°C/W  
RθJC  
RθJA  
RθJA  
Thermal Resistance, Junction-to-Case  
1.3  
40  
Thermal Resistance, Junction-to-Ambient*  
Thermal Resistance, Junction-to-Ambient  
62.5  
* When mounted on the minimum pad size recommended (PCB Mount)  
©2006 Fairchild Semiconductor Corporation  
FQB5N50CF Rev. A  
1
www.fairchildsemi.com  

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