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FQB6N40C PDF预览

FQB6N40C

更新时间: 2024-11-19 22:25:35
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
9页 663K
描述
400V N-Channel MOSFET

FQB6N40C 技术参数

是否Rohs认证: 符合生命周期:Transferred
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.7
Is Samacsys:N其他特性:FAST SWITCHING
雪崩能效等级(Eas):270 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:400 V
最大漏极电流 (ID):6 A最大漏源导通电阻:1 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G2
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):245极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):24 A认证状态:Not Qualified
表面贴装:YES端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FQB6N40C 数据手册

 浏览型号FQB6N40C的Datasheet PDF文件第2页浏览型号FQB6N40C的Datasheet PDF文件第3页浏览型号FQB6N40C的Datasheet PDF文件第4页浏览型号FQB6N40C的Datasheet PDF文件第5页浏览型号FQB6N40C的Datasheet PDF文件第6页浏览型号FQB6N40C的Datasheet PDF文件第7页 
TM  
QFET  
FQB6N40C/FQI6N40C  
400V N-Channel MOSFET  
General Description  
Features  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary,  
planar stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switched mode power supplies,  
electronic lamp ballasts based on half bridge topology.  
6A, 400V, R  
= 1.0 @V = 10 V  
DS(on) GS  
Low gate charge ( typical 16nC)  
Low Crss ( typical 15pF)  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
D
!
D
"
! "  
"
"
!
G
I2-PAK  
FQI Series  
D2-PAK  
FQB Series  
G
S
G D S  
!
S
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
FQB6N40C/FQI6N40C  
Units  
V
V
I
Drain-Source Voltage  
400  
DSS  
- Continuous (T = 25°C)  
Drain Current  
6
3.6  
A
D
C
- Continuous (T = 100°C)  
A
C
I
(Note 1)  
Drain Current  
- Pulsed  
24  
A
DM  
V
E
I
Gate-Source Voltage  
± 30  
270  
V
GSS  
AS  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
6
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
7.3  
mJ  
V/ns  
W
AR  
dv/dt  
4.5  
P
Power Dissipation (T = 25°C)  
73  
D
C
- Derate above 25°C  
Operating and Storage Temperature Range  
0.58  
-55 to +150  
W/°C  
°C  
T , T  
J
STG  
Maximum lead temperature for soldering purposes,  
T
300  
°C  
L
1/8" from case for 5 seconds  
Thermal Characteristics  
Symbol  
Parameter  
Typ  
--  
Max  
1.71  
40  
Units  
°C/W  
°C/W  
°C/W  
R
R
R
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient *  
Thermal Resistance, Junction-to-Ambient  
θJC  
θJA  
θJA  
--  
--  
62.5  
©2003 Fairchild Semiconductor Corporation  
Rev. A, August 2003  

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