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FQB6N40CFTM PDF预览

FQB6N40CFTM

更新时间: 2024-11-20 10:23:31
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
8页 1014K
描述
400V N-Channel MOSFET

FQB6N40CFTM 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.33Is Samacsys:N
雪崩能效等级(Eas):270 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:400 V
最大漏极电流 (Abs) (ID):6 A最大漏极电流 (ID):6 A
最大漏源导通电阻:1.1 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):113 W最大脉冲漏极电流 (IDM):24 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FQB6N40CFTM 数据手册

 浏览型号FQB6N40CFTM的Datasheet PDF文件第2页浏览型号FQB6N40CFTM的Datasheet PDF文件第3页浏览型号FQB6N40CFTM的Datasheet PDF文件第4页浏览型号FQB6N40CFTM的Datasheet PDF文件第5页浏览型号FQB6N40CFTM的Datasheet PDF文件第6页浏览型号FQB6N40CFTM的Datasheet PDF文件第7页 
December 2005  
TM  
FRFET  
FQB6N40CF  
400V N-Channel MOSFET  
Features  
Description  
6A, 400V, RDS(on)  
=
1.1 @VGS = 10 V  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
Low gate charge ( typical 16nC)  
Low Crss ( typical 15pF)  
Fast switching  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the avalanche  
and commutation mode. These devices are well suited for high  
efficiency switched mode power supplies, electronic lamp  
ballasts based on half bridge topology.  
100% avalanche tested  
Improved dv/dt capability  
Fast recovery body diode (typical 70ns)  
D
D
G
D2-PAK  
G
S
FQB Series  
S
Absolute Maximum Ratings  
Symbol  
Parameter  
FQB6N40CF  
Units  
V
VDSS  
ID  
Drain-Source Voltage  
400  
Drain Current  
- Continuous (TC = 25°C)  
- Continuous (TC = 100°C)  
- Pulsed  
6
3.8  
A
A
(Note 1)  
IDM  
Drain Current  
24  
A
VGSS  
EAS  
IAR  
Gate-Source Voltage  
± 30  
270  
V
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
6
EAR  
dv/dt  
PD  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Power Dissipation (TC = 25°C)  
11.3  
4.5  
mJ  
V/ns  
W
113  
- Derate above 25°C  
0.9  
W/°C  
°C  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
Maximum lead temperature for soldering purposes,  
1/8from case for 5 seconds  
300  
°C  
Thermal Characteristics  
Symbol  
Parameter  
FQB6N40CF  
Units  
°C/W  
°C/W  
°C/W  
RθJC  
RθJA  
RθJA  
Thermal Resistance, Junction-to-Case  
1.1  
40  
Thermal Resistance, Junction-to-Ambient *  
Thermal Resistance, Junction-to-Ambient  
62.5  
* When mounted on the minimum pad size recommended (PCB Mount)  
©2005 Fairchild Semiconductor Corporation  
FQB6N40CF Rev. A  
1
www.fairchildsemi.com  

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