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FQB6N60CTM PDF预览

FQB6N60CTM

更新时间: 2024-10-02 13:07:51
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
9页 548K
描述
Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET

FQB6N60CTM 技术参数

是否Rohs认证: 符合生命周期:Obsolete
Reach Compliance Code:not_compliant风险等级:5.83
配置:Single最大漏极电流 (Abs) (ID):5.5 A
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-609代码:e3
湿度敏感等级:1工作模式:ENHANCEMENT MODE
最高工作温度:150 °C极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):125 W子类别:FET General Purpose Power
表面贴装:YES端子面层:Matte Tin (Sn)
Base Number Matches:1

FQB6N60CTM 数据手册

 浏览型号FQB6N60CTM的Datasheet PDF文件第2页浏览型号FQB6N60CTM的Datasheet PDF文件第3页浏览型号FQB6N60CTM的Datasheet PDF文件第4页浏览型号FQB6N60CTM的Datasheet PDF文件第5页浏览型号FQB6N60CTM的Datasheet PDF文件第6页浏览型号FQB6N60CTM的Datasheet PDF文件第7页 
April 2000  
TM  
QFET  
FQB6N60 / FQI6N60  
600V N-Channel MOSFET  
General Description  
Features  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary,  
planar stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switch mode power supply.  
6.2A, 600V, R  
= 1.5@V = 10 V  
DS(on) GS  
Low gate charge ( typical 20 nC)  
Low Crss ( typical 10 pF)  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
D
!
D
"
! "  
"
"
G
!
G
S
D2-PAK  
FQB Series  
I2-PAK  
FQI Series  
G
D
S
!
S
Absolute Maximum Ratings  
 
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
FQB6N60 / FQI6N60  
Units  
V
V
I
Drain-Source Voltage  
600  
6.2  
DSS  
- Continuous (T = 25°C)  
Drain Current  
A
D
C
- Continuous (T = 100°C)  
3.9  
A
C
I
(Note 1)  
Drain Current  
- Pulsed  
24.8  
±30  
440  
A
DM  
V
E
I
Gate-Source Voltage  
V
GSS  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
AS  
6.2  
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
13  
mJ  
V/ns  
W
AR  
dv/dt  
4.5  
Power Dissipation (T = 25°C) *  
3.13  
130  
P
A
D
Power Dissipation (T = 25°C)  
W
C
- Derate above 25°C  
Operating and Storage Temperature Range  
1.04  
-55 to +150  
W/°C  
°C  
T , T  
J
STG  
Maximum lead temperature for soldering purposes,  
T
300  
°C  
L
1/8from case for 5 seconds  
Thermal Characteristics  
Symbol  
Parameter  
Typ  
--  
Max  
Units  
°CW  
°CW  
°CW  
R
R
R
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient *  
Thermal Resistance, Junction-to-Ambient  
0.96  
40  
θ
θ
θ
JC  
JA  
JA  
--  
--  
62.5  
* When mounted on the minimum pad size recommended (PCB Mount)  
©2000 Fairchild Semiconductor International  
Rev. A, April 2000  

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