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FQB5N80 PDF预览

FQB5N80

更新时间: 2024-11-01 22:18:35
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飞兆/仙童 - FAIRCHILD /
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9页 673K
描述
800V N-Channel MOSFET

FQB5N80 数据手册

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September 2000  
TM  
QFET  
FQB5N80 / FQI5N80  
800V N-Channel MOSFET  
General Description  
Features  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary,  
planar stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switch mode power supply.  
4.8A, 800V, R  
= 2.6@V = 10 V  
DS(on) GS  
Low gate charge ( typical 25 nC)  
Low Crss ( typical 11 pF)  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
D
!
D
"
5
3
"
"
!
G
G
S
D2-PAK  
FQB Series  
I2-PAK  
FQI Series  
G
D
S
!
S
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
FQB5N80 / FQI5N80  
Units  
V
V
I
Drain-Source Voltage  
800  
4.8  
DSS  
- Continuous (T = 25°C)  
Drain Current  
A
D
C
- Continuous (T = 100°C)  
3.04  
19.2  
± 30  
590  
A
C
I
(Note 1)  
Drain Current  
- Pulsed  
A
DM  
V
E
I
Gate-Source Voltage  
V
GSS  
AS  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
4.8  
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
14  
mJ  
V/ns  
W
AR  
dv/dt  
4.0  
Power Dissipation (T = 25°C) *  
3.13  
140  
P
A
D
Power Dissipation (T = 25°C)  
W
C
- Derate above 25°C  
Operating and Storage Temperature Range  
1.12  
-55 to +150  
W/°C  
°C  
T , T  
J
STG  
Maximum lead temperature for soldering purposes,  
T
300  
°C  
L
1/8" from case for 5 seconds  
Thermal Characteristics  
Symbol  
Parameter  
Typ  
--  
Max  
0.89  
40  
Units  
°C/W  
°C/W  
°C/W  
R
R
R
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient *  
Thermal Resistance, Junction-to-Ambient  
θJC  
θJA  
θJA  
--  
--  
62.5  
* When mounted on the minimum pad size recommended (PCB Mount)  
©2000 Fairchild Semiconductor International  
Rev. A, September 2000  

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