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FQB5P20TM PDF预览

FQB5P20TM

更新时间: 2024-11-20 13:07:51
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
9页 634K
描述
Power Field-Effect Transistor, 4.8A I(D), 200V, 1.4ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, D2PAK-3

FQB5P20TM 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:D2PAK包装说明:D2PAK-3
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:5.66Is Samacsys:N
雪崩能效等级(Eas):330 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:200 V
最大漏极电流 (Abs) (ID):4.8 A最大漏极电流 (ID):4.8 A
最大漏源导通电阻:1.4 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):75 W
最大脉冲漏极电流 (IDM):19.2 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FQB5P20TM 数据手册

 浏览型号FQB5P20TM的Datasheet PDF文件第2页浏览型号FQB5P20TM的Datasheet PDF文件第3页浏览型号FQB5P20TM的Datasheet PDF文件第4页浏览型号FQB5P20TM的Datasheet PDF文件第5页浏览型号FQB5P20TM的Datasheet PDF文件第6页浏览型号FQB5P20TM的Datasheet PDF文件第7页 
May 2000  
TM  
QFET  
FQB5P20 / FQI5P20  
200V P-Channel MOSFET  
General Description  
These P-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary,  
planar stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switching DC/DC converters.  
Features  
-4.8A, -200V, R  
= 1.4@V = -10 V  
DS(on) GS  
Low gate charge ( typical 10 nC)  
Low Crss ( typical 12 pF)  
Fast switching  
100% avalanche tested  
S
!
D
G!  
G
S
D2-PAK  
FQB Series  
I2-PAK  
FQI Series  
G
D
S
!
D
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
FQB5P20 / FQI5P20  
Units  
V
V
I
Drain-Source Voltage  
-200  
-4.8  
DSS  
- Continuous (T = 25°C)  
Drain Current  
A
D
C
- Continuous (T = 100°C)  
-3.04  
-19.2  
± 30  
A
C
I
(Note 1)  
Drain Current  
- Pulsed  
A
DM  
V
E
I
Gate-Source Voltage  
V
GSS  
AS  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
330  
mJ  
A
-4.8  
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
7.5  
mJ  
V/ns  
W
AR  
dv/dt  
-5.5  
Power Dissipation (T = 25°C) *  
3.13  
P
A
D
Power Dissipation (T = 25°C)  
75  
W
C
- Derate above 25°C  
Operating and Storage Temperature Range  
0.6  
W/°C  
°C  
T , T  
-55 to +150  
J
STG  
Maximum lead temperature for soldering purposes,  
T
300  
°C  
L
1/8" from case for 5 seconds  
Thermal Characteristics  
Symbol  
Parameter  
Typ  
--  
Max  
1.67  
40  
Units  
°C/W  
°C/W  
°C/W  
R
R
R
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient *  
Thermal Resistance, Junction-to-Ambient  
θJC  
θJA  
θJA  
--  
--  
62.5  
* When mounted on the minimum pad size recommended (PCB Mount)  
©2000 Fairchild Semiconductor International  
Rev. A, May 2000  

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