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FDMC89521L PDF预览

FDMC89521L

更新时间: 2024-09-15 11:13:31
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 266K
描述
双 N 沟道,Power Trench® MOSFET,60V,8.2A,17mΩ

FDMC89521L 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET – Dual N-Channel,  
POWERTRENCH)  
Pin 1  
Pin 1  
G1 S1 S1 S1  
D1  
D2  
60 V, 8.2 A, 17 mW  
FDMC89521L  
S2 S2  
G2 S2  
General Description  
Power 33  
This device includes two 60 V NChannel MOSFETs in a dual  
Power 33 (3 mm x 3 mm MLP) package. The package is enhanced for  
exceptional thermal performance.  
WDFN8 3x3, 0.65P  
CASE 511DG  
Features  
MARKING DIAGRAM  
Max r  
Max r  
= 17 mW at V = 10 V, I = 8.2 A  
GS D  
DS(on)  
DS(on)  
= 27 mW at V = 4.5 V, I = 6.7 A  
GS  
D
$Y&Z&2&K  
FDMC  
89521L  
Termination is Leadfree  
These Devices are RoHS Compliant  
Applications  
Battery Protection  
Load Switching  
Bridge Topologies  
$Y  
&Z  
&2  
&K  
= onsemi Logo  
= Assembly Plant Code  
= Numeric Date Code  
= Lot Code  
FDMC89521L  
= Specific Device Code  
MOSFET MAXIMUM RATINGS (TA = 25°C unless otherwise noted)  
Symbol  
VDS  
Parameter  
Drain to Source Voltage  
Ratings Units  
PIN ASSIGNMENT  
60  
20  
V
V
A
VGS  
Gate to Source Voltage  
G2  
G1  
S1  
ID  
Drain Current  
Continuous  
Pulsed  
TA = 25°C  
(Note 1a)  
(Note 3)  
8.2  
40  
S2  
S2  
S2  
EAS  
PD  
Single Pulse Avalanche Energy  
Power Dissipation TC = 25°C  
Power Dissipation TA = 25°C  
32  
16  
mJ  
W
S1  
S1  
(Note 1a)  
1.9  
TJ, TSTG Operating and Storage Junction Temperature  
Range  
55 to  
+150  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
NChannel MOSFET  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 6 of  
this data sheet.  
THERMAL CHARACTERISTICS  
Symbol  
RθJC  
Parameter  
Ratings  
8.0  
Unit  
°C/W  
°C/W  
Thermal Resistance, JunctiontoCase  
RθJA  
Thermal Resistance, JunctiontoAmbient  
(Note 1a)  
65  
RθJA  
Thermal Resistance, JunctiontoAmbient  
(Note 1b)  
155  
°C/W  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
February, 2023 Rev. 2  
FDMC89521L/D  

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