DATA SHEET
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MOSFET – Dual, N-Channel
POWERTRENCH)
PQFN12 3.3X5, 0.65P
CASE 483BN
40 V, 103 A, 2.6 mW
FDMD8240LET40
Description
This Device Includes Two 40V N−Channel MOSFETs in a Dual
Power (3.3 mm x 5 mm) package. HS source and LS Drain are
internally connected for half/full bridge, low source inductance
1
2
3
4
12
11
10
9
G1
D1
D1
D1
G1R
D2/S1
package, low R
/Qg FOM silicon.
G2
S2
S2
D2/S1
D2/S1
DS(on)
8
5
6
Features
7
D2/S1
• Extended T Rating to 175°C
J
• Max R
• Max R
= 2.6 m ꢀ at V = 10 V, I = 23 A
GS D
DS(on)
= 3.95 m ꢀ at V = 4.5 V, I = 19 A
DS(on)
GS
D
MARKING DIAGRAM
• Ideal for Flexible Layout in Primary Side of Bridge Topology
• 100% UIL Tested
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FDMD
8240LET
• Kelvin High Side MOSFET Drive Pin−out Capability
• These Device is Pb−Free, Halide Free, and is RoHS Compliant
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Z
= onsemi Logo
Typical Applications
= Assembly Plant Code
= Date Code (Year & Week)
= Lot Traceability Code
= Specific Device Code
• Synchronous Buck : Primary Switch of Half / Full Bridge Converter
for Telecom
• Motor Bridge : Primary Switch of Half / Full bridge Converter for
BLDC Motor
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FDMD8240LET
ORDERING INFORMATION
• MV POL : Synchronous Buck Switch
†
Device
Shipping
Package
MOSFET MAXIMUM RATINGS T = 25°C unless otherwise noted
FDMD8240LET40
PQFN12
3000 /
A
(Pb−Free)
Tape & Reel
Symbol
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Value
40
Unit
V
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
V
DS
V
GS
20
V
I
D
A
− Continuous T = 25°C (Note 5)
103
73
24
489
C
− Continuous T = 100°C (Note 5)
C
− Continuous T = 25°C (Note 1 a)
A
− Pulsed (Note 4)
E
mJ
W
Single Pulse Avalanche Energy (Note 3)
216
50
AS
P
Power Dissipation T = 25°C
D
C
Power Dissipation T = 25°C (Note 1 a)
2.5
A
T , T
Operating and Storage Junction
Temperature Range
−55 to +175
°C
J
STG
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
May, 2023 − Rev 2
FDMD8240LET40/D