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FDME1024NZT

更新时间: 2024-09-15 12:33:55
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管开关光电二极管
页数 文件大小 规格书
7页 269K
描述
Dual N-Channel PowerTrench MOSFET 20 V, 3.8 A, 66 m

FDME1024NZT 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:UMLP
包装说明:SMALL OUTLINE, S-PDSO-N6针数:6
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:3.89
其他特性:ESD PROTECTION外壳连接:DRAIN
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (Abs) (ID):3.4 A最大漏极电流 (ID):3.8 A
最大漏源导通电阻:0.066 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):40 pFJESD-30 代码:S-PDSO-N6
JESD-609代码:e4湿度敏感等级:1
元件数量:2端子数量:6
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):1.3 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:NO LEAD端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDME1024NZT 数据手册

 浏览型号FDME1024NZT的Datasheet PDF文件第2页浏览型号FDME1024NZT的Datasheet PDF文件第3页浏览型号FDME1024NZT的Datasheet PDF文件第4页浏览型号FDME1024NZT的Datasheet PDF文件第5页浏览型号FDME1024NZT的Datasheet PDF文件第6页浏览型号FDME1024NZT的Datasheet PDF文件第7页 
July 2010  
FDME1024NZT  
Dual N-Channel PowerTrench® MOSFET  
20 V, 3.8 A, 66 mΩ  
Features  
General Description  
„ Max rDS(on) = 66 mΩ at VGS = 4.5 V, ID = 3.4 A  
„ Max rDS(on) = 86 mΩ at VGS = 2.5 V, ID = 2.9 A  
„ Max rDS(on) = 113 mΩ at VGS = 1.8 V, ID = 2.5 A  
„ Max rDS(on) = 160 mΩ at VGS = 1.5 V, ID = 2.1 A  
This device is designed specifically as a single package solution  
for dual switching requirement in cellular handset and other  
ultra-portable applications. It features two independent  
N-Channel MOSFETs with low on-state resistance for minimum  
conduction losses.  
„ Low profile: 0.55 mm maximum in the new package  
MicroFET 1.6x1.6 Thin  
The MicroFET 1.6x1.6 Thin package offers exceptional thermal  
performance for it's physical size and is well suited to switching  
and linear mode applications.  
„ Free from halogenated compounds and antimony oxides  
„ HBM ESD protection level > 1600 V (Note 3)  
„ RoHS Compliant  
Applications  
„ Baseband Switch  
„ Load Switch  
D2  
G1  
S1  
D2  
Pin 1  
D1  
S2  
G2  
D1  
BOTTOM  
TOP  
MicroFET 1.6x1.6 Thin  
MOSFET Maximum Ratings TA = 25 °C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current -Continuous  
-Pulsed  
20  
V
V
±8  
TA = 25 °C  
(Note 1a)  
3.8  
ID  
A
6
1.4  
Power Dissipation for Single Operation  
Power Dissipation for Single Operation  
TA = 25 °C  
TA = 25 °C  
(Note 1a)  
(Note 1b)  
PD  
W
0.6  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
Thermal Characteristics  
RθJA  
RθJA  
Thermal Resistance, Junction to Ambient (Single Operation)  
Thermal Resistance, Junction to Ambient (Single Operation)  
(Note 1a)  
(Note 1b)  
90  
°C/W  
195  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
7 ’’  
Tape Width  
8 mm  
Quantity  
4T  
FDME1024NZT  
MicroFET 1.6x1.6 Thin  
5000 units  
©2010 Fairchild Semiconductor Corporation  
FDME1024NZT Rev.C1  
www.fairchildsemi.com  
1

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