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FDME1023PZT PDF预览

FDME1023PZT

更新时间: 2024-09-16 11:16:03
品牌 Logo 应用领域
安森美 - ONSEMI 开关光电二极管晶体管
页数 文件大小 规格书
8页 269K
描述
双 P 沟道,Power Trench® MOSFET,-20V,-2.6A,142mΩ

FDME1023PZT 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, S-PDSO-N6Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.21.00.95
Factory Lead Time:1 week风险等级:1.01
其他特性:ESD PROTECTION外壳连接:DRAIN
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (Abs) (ID):2.3 A最大漏极电流 (ID):2.6 A
最大漏源导通电阻:0.142 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):75 pFJESD-30 代码:S-PDSO-N6
JESD-609代码:e4湿度敏感等级:1
元件数量:2端子数量:6
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):1.3 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:NO LEAD端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDME1023PZT 数据手册

 浏览型号FDME1023PZT的Datasheet PDF文件第2页浏览型号FDME1023PZT的Datasheet PDF文件第3页浏览型号FDME1023PZT的Datasheet PDF文件第4页浏览型号FDME1023PZT的Datasheet PDF文件第5页浏览型号FDME1023PZT的Datasheet PDF文件第6页浏览型号FDME1023PZT的Datasheet PDF文件第7页 
DATA SHEET  
www.onsemi.com  
D2  
G1  
MOSFET – Dual P-Channel  
POWERTRENCH)  
S1  
Pin 1  
D2  
D1  
S2  
G2  
-20 V, -2.6 A, 142 mW  
D1  
Bottom  
Top  
FDME1023PZT  
Description  
This device is designed specifically as a single package solution  
for the battery charges switch in cellular handset and other  
ultraportable applications. It features two independent PChannel  
MOSFETs with low onstate resistance for minimum conduction  
losses. When connected in the typical common source configuration,  
bidirectional current flow is possible.  
UDFN6 1.6y1.6 0.5P  
(MicroFETt 1.6y1.6 Thin)  
CASE 517DW  
ELECTRICAL CONNECTION  
D1  
G2  
S2  
S1  
1
6
The MicroFET 1.6y1.6 Thin package offers exceptional thermal  
performance for it’s physical size and is well suited to switching and  
linear mode applications.  
G1  
D2  
2
3
5
4
Features  
Max R  
Max R  
Max R  
Max R  
= 142 mW at V = 4.5 V, I = 2.3 A  
GS D  
DS(on)  
DS(on)  
DS(on)  
DS(on)  
= 213 mW at V = 2.5 V, I = 1.8 A  
GS  
D
= 331 mW at V = 1.8 V, I = 1.5 A  
Dual PChannel MOSFET  
GS  
D
(Top View)  
= 530 mW at V = 1.5 V, I = 1.2 A  
GS  
D
Low Profile: 0.55 mm Maximum in the New Package  
MicroFET 1.6x1.6 Thin  
MARKING DIAGRAM  
HBM ESD Protection Level > 1600 V (Note 3)  
This Device is PbFree, Halide Free and RoHS Compliant  
&Z&2&K  
2T  
Typical Applications  
Load Switch  
Battery Charging  
Battery Disconnect Switch  
&Z = Assembly Plant Code  
&2 = 2Digit Date Code (Year and Week)  
&K = 2Digit Lot Run Code  
2T = Specific Device Code  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
Symbol  
Parameter  
Drain to Source Voltage  
Value  
20  
8
Unit  
V
ORDERING INFORMATION  
See detailed ordering and shipping information on page 6 of  
this data sheet.  
V
DS  
V
GS  
Gate to Source Voltage  
V
I
D
Drain Current  
– Continuous (Note 1a)  
– Pulsed  
A
T = 25°C  
A
2.6  
6  
P
D
Power Dissipation for Single Operation  
W
(Note 1a)  
(Note 1b)  
T = 25°C  
1.4  
0.6  
A
A
T = 25°C  
T , T  
Operating and Storage Junction  
Temperature Range  
–55 to  
+150  
°C  
J
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
© Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
April, 2023 Rev 3  
FDME1023PZT/D  

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