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FDB024N04AL7 PDF预览

FDB024N04AL7

更新时间: 2024-11-14 12:46:19
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
9页 390K
描述
FDB024N04AL7 N-Channel PowerTrench® MOSFET

FDB024N04AL7 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Transferred零件包装代码:D2PAK
包装说明:ROHS COMPLIANT, D2PAK-7针数:7
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:3.87
Is Samacsys:N其他特性:ULTRA-LOW RESISTANCE
雪崩能效等级(Eas):864 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:40 V
最大漏极电流 (Abs) (ID):219 A最大漏极电流 (ID):100 A
最大漏源导通电阻:0.0024 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G6JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:6工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):245极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):214 W最大脉冲漏极电流 (IDM):876 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDB024N04AL7 数据手册

 浏览型号FDB024N04AL7的Datasheet PDF文件第2页浏览型号FDB024N04AL7的Datasheet PDF文件第3页浏览型号FDB024N04AL7的Datasheet PDF文件第4页浏览型号FDB024N04AL7的Datasheet PDF文件第5页浏览型号FDB024N04AL7的Datasheet PDF文件第6页浏览型号FDB024N04AL7的Datasheet PDF文件第7页 
August 2010  
FDB024N04AL7  
N-Channel PowerTrench MOSFET  
40V, 219A, 2.4mΩ  
®
Features  
Description  
RDS(on) = 2.0mΩ ( Typ.)@ VGS = 10V, ID = 80A  
This N-Channel MOSFET is produced using Fairchild  
Semiconductor’s advanced PowerTrench process that has been  
especially tailored to minimize the on-state resistance and yet  
maintain superior switching performance.  
Fast Switching Speed  
Low Gate Charge  
High Performance Trench Technology for Extremely Low  
RDS(on)  
Application  
High Power and Current Handling Capability  
RoHS Compliant  
DC to DC Convertors / Synchronous Rectification  
D (Pin4, tab)  
G
(Pin1)  
D2-PAK-7L  
FDB Series with suffix -L7  
S (Pin2,3,5,6,7)  
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*  
Symbol  
VDSS  
VGSS  
Parameter  
Ratings  
40  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
V
V
±20  
- Continuous (TC = 25oC, Silicon Limited)  
- Continuous (TC = 100oC, Silicon Limited)  
- Continuous (TC = 25oC, Package Limited)  
219*  
155*  
100  
ID  
D r a in C u r r e n t  
A
IDM  
D rai n Cur rent  
- P uls ed  
(Note 1)  
(Note 2)  
(Note 3)  
876  
A
mJ  
EAS  
dv/dt  
Single Pulsed Avalanche Energy  
Peak Diode Recovery dv/dt  
864  
6.0  
V/ns  
W
W/oC  
oC  
(TC = 25oC)  
- Derate above 25oC  
214  
PD  
Power Dissipation  
1.43  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +175  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
300  
oC  
*Calculated continuous current based on maximum allowable junction temperature. Package limitation current is 100A.  
Thermal Characteristics  
Symbol  
RθJC  
RθJA  
Parameter  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
Ratings  
0.7  
Units  
oC/W  
62.5  
©2010 Fairchild Semiconductor Corporation  
FDB024N04AL7 Rev. A2  
1
www.fairchildsemi.com  

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