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EDE5108GBSA-4A-E PDF预览

EDE5108GBSA-4A-E

更新时间: 2024-11-07 22:38:51
品牌 Logo 应用领域
尔必达 - ELPIDA 动态存储器双倍数据速率
页数 文件大小 规格书
56页 375K
描述
512M bits DDR-II SDRAM

EDE5108GBSA-4A-E 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA, BGA64,9X15,32
针数:64Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.28
风险等级:5.84访问模式:FOUR BANK PAGE BURST
最长访问时间:0.6 ns其他特性:AUTO/SELF REFRESH
最大时钟频率 (fCLK):200 MHzI/O 类型:COMMON
交错的突发长度:4,8JESD-30 代码:R-PBGA-B64
JESD-609代码:e1内存密度:536870912 bit
内存集成电路类型:DDR DRAM内存宽度:8
功能数量:1端口数量:1
端子数量:64字数:67108864 words
字数代码:64000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:64MX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA64,9X15,32封装形状:RECTANGULAR
封装形式:GRID ARRAY峰值回流温度(摄氏度):NOT SPECIFIED
电源:1.8 V认证状态:Not Qualified
刷新周期:8192自我刷新:YES
连续突发长度:4,8子类别:DRAMs
最大供电电压 (Vsup):1.9 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED

EDE5108GBSA-4A-E 数据手册

 浏览型号EDE5108GBSA-4A-E的Datasheet PDF文件第2页浏览型号EDE5108GBSA-4A-E的Datasheet PDF文件第3页浏览型号EDE5108GBSA-4A-E的Datasheet PDF文件第4页浏览型号EDE5108GBSA-4A-E的Datasheet PDF文件第5页浏览型号EDE5108GBSA-4A-E的Datasheet PDF文件第6页浏览型号EDE5108GBSA-4A-E的Datasheet PDF文件第7页 
PRELIMINARY DATA SHEET  
512M bits DDR-II SDRAM  
EDE5104GBSA (128M words × 4 bits)  
EDE5108GBSA (64M words × 8 bits)  
EDE5116GBSA (32M words × 16 bits)  
Features  
Description  
The EDE5104GB is a 512M bits DDR-II SDRAM  
1.8V power supply  
organized as 33,554,432 words × 4 bits × 4 banks.  
Double-data-rate architecture: two data transfers per  
clock cycle  
The EDE5108GB is a 512M bits DDR-II SDRAM  
organized as 16,777,216 words × 8 bits × 4 banks.  
Bi-directional, differential data strobe (DQS and  
/DQS) is transmitted/received with data, to be used in  
capturing data at the receiver  
It packaged in 64-ball µBGA package.  
DQS is edge aligned with data for READs: center-  
aligned with data for WRITEs  
The EDE5116GB is a 512M bits DDR-II SDRAM  
organized as 8,388,608 words × 16 bits × 4 banks.  
Differential clock inputs (CK and /CK)  
It is packaged in 84-ball µBGA package.  
DLL aligns DQ and DQS transitions with CK  
transitions  
Commands entered on each positive CK edge: data  
and data mask referenced to both edges of DQS  
Four internal banks for concurrent operation  
Data mask (DM) for write data  
Burst lengths: 4, 8  
/CAS Latency (CL): 3, 4, 5  
Auto precharge operation for each burst access  
Auto refresh and self refresh modes  
7.8µs average periodic refresh interval  
1.8V (SSTL_18 compatible) I/O  
Posted CAS by programmable additive latency for  
better command and data bus efficiency  
Off-Chip-Driver Impedance Adjustment and On-Die-  
Termination for better signal quality  
Programmable RDQS, /RDQS output for making × 8  
organization compatible to × 4 organization  
/DQS, (/RDQS) can be disabled for single-ended  
Data Strobe operation.  
• µBGA package is lead free solder (Sn-Ag-Cu)  
Document No. E0249E30 (Ver. 3.0)  
Date Published August 2002 (K) Japan  
URL: http://www.elpida.com  
Elpida Memory, Inc. 2002  

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