PRELIMINARY DATA SHEET
512M bits DDR-II SDRAM
EDE5104GASA (128M words × 4 bits)
EDE5108GASA (64M words × 8 bits)
Pin Configurations
Description
The EDE5104GA is a 512M bits DDR-II SDRAM
/xxx indicates active low signal.
60-ball FBGA
organized as 33,554,432 words × 4 bits × 4 banks.
1
2
3
7
8
9
The EDE5108GA is a 512M bits DDR-II SDRAM
organized as 16,777,216 words × 8 bits × 4 banks.
A
B
C
D
E
F
G
H
J
NU/ /RDQS
(NC)*
VDD
VSS
VSSQ /DQS VDDQ
It is packaged in 60-ball FBGA package.
DQ6
(NC)*
DQ7
DQS VSSQ
(NC)*
DM/RDQS
(DM)*
Features
VSSQ
• 1.8V power supply
VDDQ
DQ1 VDDQ
VSSQ DQ3
VREF VSS
CKE /WE
VDDQ DQ0 VDDQ
• Double-data-rate architecture: two data transfers per
clock cycle
DQ4
(NC)*
DQ5
DQ2 VSSQ
(NC)*
• Bi-directional, differential data strobe (DQS and
/DQS) is transmitted/received with data, to be used in
capturing data at the receiver
VDDL
VSSDL CK
VDD
NC
/RAS
/CAS
A2
/CK
/CS
A0
• DQS is edge aligned with data for READs: center-
aligned with data for WRITEs
BA0
A10
A3
BA1
A1
NC
• Differential clock inputs (CK and /CK)
VDD
VSS
• DLL aligns DQ and DQS transitions with CK
transitions
A5
A6
A4
VSS
VDD
• Commands entered on each positive CK edge: data
and data mask referenced to both edges of DQS
K
L
A7
A9
A11
NC
A8
• Four internal banks for concurrent operation
• Data mask (DM) for write data
A12
NC
NC
• Burst lengths: 4 only
(Top view)
Note: ( )* marked pins are for EDE5104GA.
• /CAS Latency (CL): 3, 4
• Auto precharge operation for each burst access
• Auto refresh and self refresh modes
• 7.8µs maximum average periodic refresh interval
• 1.8V (SSTL_18 compatible) I/O
A0 to A12
BA0, BA1
DQ0 to DQ7
DQS, /DQS
RDQS, /RDQS
/CS
/RAS, /CAS, /WE
CKE
CK, /CK
DM
VDD
VSS
VDDQ
VSSQ
VREF
VDDL
VSSDL
NC*1
NU*2
Address input
Bank select address
Data-input/output
Differential data strobe
Differential data strobe for read
Chip select
Command input
Clock enable
Differential Clock input
Output mask
Power for internal circuit
Ground for internal circuit
Power for DQ circuit
Ground for DQ circuit
Reference supply voltage
Power for DLL circuit
Ground for DLL circuit
No connection
• Off-Chip-Driver Impedance Adjustment for better
signal quality.
• Programmable RDQS, /RDQS output for the
compatibility to × 4 organization
• /DQS, (/RDQS) can be disabled for single-ended
Data Strobe operation.
• FBGA package is lead free solder (Sn-Ag-Cu)
Not usable
Notes: 1. Not internally connected with die.
2. Don't connect. Internally connected with die.
Document No. E0203E41 (Ver. 4.1)
Date Published February 2006 (K) Japan
URL: http://www.elpida.com
This product became EOL in March, 2004.
Elpida Memory, Inc. 2001-2006