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CY62126EV30_11 PDF预览

CY62126EV30_11

更新时间: 2024-09-13 09:42:43
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
18页 482K
描述
1-Mbit (64 K x 16) Static RAM Automatic power down when deselected

CY62126EV30_11 数据手册

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CY62126EV30 MoBL®  
1-Mbit (64 K × 16) Static RAM  
1-Mbit (64  
K × 16) Static RAM  
Features  
Functional Description  
High speed: 45 ns  
The CY62126EV30 is a high performance CMOS static RAM  
organized as 64K words by 16 bits. This device features  
advanced circuit design to provide ultra low active current. This  
is ideal for providing More Battery Life(MoBL®) in portable  
applications such as cellular telephones. The device also has an  
automatic power down feature that significantly reduces power  
consumption when addresses are not toggling. Placing the  
device in standby mode reduces power consumption by more  
than 99 percent when deselected (CE HIGH). The input and  
output pins (I/O0 through I/O15) are placed in a high impedance  
state when the device is deselected (CE HIGH), the outputs are  
disabled (OE HIGH), both Byte High Enable and Byte Low  
Enable are disabled (BHE, BLE HIGH) or during a write  
operation (CE LOW and WE LOW).  
Temperature ranges  
Industrial: –40 °C to +85 °C  
Automotive: –40 °C to +125 °C  
Wide voltage range: 2.2 V to 3.6 V  
Pin compatible with CY62126DV30  
Ultra low standby power  
Typical standby current: 1 A  
Maximum standby current: 4 A  
Ultra low active power  
Typical active current: 1.3 mA at f = 1 MHz  
To write to the device, take Chip Enable (CE) and Write Enable  
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data  
from I/O pins (I/O0 through I/O7) is written into the location  
specified on the address pins (A0 through A15). If Byte High  
Enable (BHE) is LOW, then data from I/O pins (I/O8 through  
I/O15) is written into the location specified on the address pins  
(A0 through A15).  
Easy memory expansion with CE and OE features  
Automatic power down when deselected  
Complementary metal oxide semiconductor (CMOS) for  
optimum speed and power  
Offered in Pb-free 48-ball very fine-pitch ball grid array  
(VFBGA) and 44-pin thin small outline package (TSOP) II  
packages  
To read from the device, take Chip Enable (CE) and Output  
Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If  
Byte Low Enable (BLE) is LOW, then data from the memory  
location specified by the address pins appear on I/O0 to I/O7. If  
Byte High Enable (BHE) is LOW, then data from memory  
appears on I/O8 to I/O15. See the Truth Table on page 11 for a  
complete description of read and write modes.  
Logic Block Diagram  
DATA IN DRIVERS  
A
10  
9
A
A
A
8
7
6
5
4
A
A
A
64K x 16  
I/O –I/O  
RAM Array  
0
7
A
A
A
A
3
2
1
0
I/O –I/O  
8
15  
COLUMN DECODER  
BHE  
WE  
CE  
OE  
BLE  
Cypress Semiconductor Corporation  
Document Number: 38-05486 Rev. *I  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised May 31, 2011  
[+] Feedback  

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