27BV
CY62127BV
64K x 16 Static RAM
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O1 through I/O8), is
written into the location specified on the address pins (A0
through A15). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O9 through I/O16) is written into the location
specified on the address pins (A0 through A15).
Features
• 2.7V–3.6V operation
• CMOS for optimum speed/power
• Low active power (70 ns, LL version)
— 54 mW (max.) (15 mA)
• Low standby power (70 ns, LL version)
— 54 µW (max.) (15 µA)
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O1 to I/O8. If Byte High Enable (BHE) is
LOW, then data from memory will appear on I/O9 to I/O16. See
the truth table at the back of this data sheet for a complete
description of read and write modes.
• Automatic power-down when deselected
— Power down either with CE or BHE and BLE HIGH
• Independent control of Upper and Lower Bytes
• Available in 44-pin TSOP II (forward) and fBGA
Functional Description
The input/output pins (I/O1 through I/O16) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a write operation (CE
LOW, and WE LOW).
The CY62127BV is a high-performance CMOS Static RAM
organized as 65,536 words by 16 bits. This device has an au-
tomatic power-down feature that significantly reduces power
consumption by 99% when deselected. The device enters
power-down mode when CE is HIGH or when CE is LOW and
both BLE and BHE are HIGH.
The CY62127BV is available in standard 44-pin TSOP Type II
(forward pinout) and fBGA packages.
Logic Block Diagram
Pin
Configurations
TSOP II (Forward)
Top View
DATA IN DRIVERS
44
1
A
4
A
5
43
42
41
40
39
38
A
A
2
3
4
5
6
3
6
A
A
A
A
A
A
A
A
A
12
11
10
A
A
2
7
OE
A
1
A
BHE
BLE
I/O
I/O
I/O
0
9
7
6
CE
64K x 16
I/O
7
1
16
I/O –I/O
RAM Array
1024 X 1024
37
36
35
34
33
1
8
I/O
I/O
8
2
3
15
14
13
3
2
9
I/O –I/O
10
11
12
13
9
16
I/O
V
SS
I/O
4
CC
V
SS
1
0
V
V
CC
A
I/O
32
31
30
29
28
27
I/O
I/O
5
6
7
8
12
11
I/O
I/O
I/O
14
15
16
I/O
I/O
10
9
COLUMN DECODER
WE 17
18
NC
A
A
A
A
15
14
13
8
19
20
21
22
26
25
A
9
10
11
A
A
BHE
A
12
WE
CE
OE
24
23
NC
NC
BLE
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
Document #: 38-05155 Rev. **
Revised September 6, 2001