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CY62126EV30LL-55BVXET PDF预览

CY62126EV30LL-55BVXET

更新时间: 2024-11-06 11:10:03
品牌 Logo 应用领域
英飞凌 - INFINEON 静态存储器内存集成电路
页数 文件大小 规格书
18页 518K
描述
Asynchronous SRAM

CY62126EV30LL-55BVXET 数据手册

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CY62126EV30 MoBL®  
1-Mbit (64 K × 16) Static RAM  
1-Mbit (64  
K × 16) Static RAM  
Features  
Functional Description  
High speed: 45 ns  
The CY62126EV30 is a high performance CMOS static RAM  
organized as 64K words by 16 bits. This device features  
advanced circuit design to provide ultra low active current. This  
is ideal for providing More Battery Life(MoBL®) in portable  
applications such as cellular telephones. The device also has an  
automatic power down feature that significantly reduces power  
consumption when addresses are not toggling. Placing the  
device in standby mode reduces power consumption by more  
than 99 percent when deselected (CE HIGH). The input and  
output pins (I/O0 through I/O15) are placed in a high impedance  
state when the device is deselected (CE HIGH), the outputs are  
disabled (OE HIGH), both Byte High Enable and Byte Low  
Enable are disabled (BHE, BLE HIGH) or during a write  
operation (CE LOW and WE LOW).  
Temperature ranges  
Industrial: –40 °C to +85 °C  
Automotive-A: –40 °C to +85 °C  
Automotive-E: –40 °C to +125 °C  
Wide voltage range: 2.2 V to 3.6 V  
Pin compatible with CY62126DV30  
Ultra low standby power  
Typical standby current: 1 A  
Maximum standby current: 4 A  
Ultra low active power  
To write to the device, take Chip Enable (CE) and Write Enable  
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data  
from I/O pins (I/O0 through I/O7) is written into the location  
specified on the address pins (A0 through A15). If Byte High  
Enable (BHE) is LOW, then data from I/O pins (I/O8 through  
I/O15) is written into the location specified on the address pins  
(A0 through A15).  
Typical active current: 1.3 mA at f = 1 MHz  
Easy memory expansion with CE and OE features  
Automatic power down when deselected  
Complementary metal oxide semiconductor (CMOS) for  
optimum speed and power  
To read from the device, take Chip Enable (CE) and Output  
Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If  
Byte Low Enable (BLE) is LOW, then data from the memory  
location specified by the address pins appear on I/O0 to I/O7. If  
Byte High Enable (BHE) is LOW, then data from memory  
appears on I/O8 to I/O15. See the Truth Table on page 11 for a  
complete description of read and write modes.  
Offered in Pb-free 48-ball very fine-pitch ball grid array  
(VFBGA) and 44-pin thin small outline package (TSOP) II  
packages  
For a complete list of related documentation, click here.  
Logic Block Diagram  
DATA IN DRIVERS  
A10  
A9  
A8  
A7  
A6  
A5  
A4  
A3  
64K x 16  
I/O0–I/O7  
RAM Array  
I/O8–I/O15  
A2  
A1  
A0  
COLUMN DECODER  
BHE  
WE  
CE  
OE  
BLE  
Cypress Semiconductor Corporation  
Document Number: 38-05486 Rev. *P  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised November 24, 2017  

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