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BUK9V13-40H PDF预览

BUK9V13-40H

更新时间: 2024-11-24 11:13:19
品牌 Logo 应用领域
安世 - NEXPERIA /
页数 文件大小 规格书
13页 306K
描述
Dual N-channel 40 V, 13 mOhm logic level MOSFET in LFPAK56D (half-bridge configuration)Production

BUK9V13-40H 数据手册

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BUK9V13-40H  
Dual N-channel 40 V, 13 mOhm logic level MOSFET in  
LFPAK56D (half-bridge configuration)  
9 May 2023  
Product data sheet  
1. General description  
D1  
Dual, logic level N-channel MOSFET in an LFPAK56D package  
(half-bridge configuration), using Trench 9 TrenchMOS technology. This  
product has been designed and qualified to AEC-Q101.  
G1  
G2  
An internal connection is made between the source (S1) of the high-  
side FET to the drain (D2) of the low-side FET, making the device ideal  
to use as a half-bridge switch in high-performance automotive PWM  
applications.  
S1, D2  
S2  
aaa-028081  
2. Features and benefits  
LFPAK56D package with half-bridge configuration enables:  
Reduced PCB layout complexity  
PCB shrinkage through reduced component footprint for 3-phase motor drive  
Improved system level Rth(j-amb) due to optimized package design  
Lower parasitic inductance to support higher efficiency  
Footprint compatibility with LFPAK56D Dual package  
Advanced AEC-Q101 grade Trench 9 silicon technology:  
Low power losses, high power density  
Superior avalanche performance  
Repetitive avalanche rated  
LFPAK copper clip packaging provides high robustness and reliability  
Gull wing leads support high manufacturability and Automated Optical Inspection (AOI)  
3. Applications  
12 V automotive systems  
Powertrain, chassis, body and infotainment applications  
Brushless or brushed DC motor drive  
DC-to-DC systems  
LED lighting  
4. Quick reference data  
Table 1. Quick reference data  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Limiting values FET1 and FET2  
VDS  
ID  
drain-source voltage  
drain current  
25 °C ≤ Tj ≤ 175 °C  
-
-
-
-
-
-
40  
42  
46  
V
VGS = 10 V; Tmb = 25 °C; Fig. 2  
[1]  
A
Ptot  
total power dissipation Tmb = 25 °C; Fig. 1  
W
 
 
 
 

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