PD - 97597A
AUTOMOTIVEGRADE
AUIRFR4105
HEXFET® Power MOSFET
Features
D
V(BR)DSS
55V
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●
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AdvancedPlanarTechnology
LowOn-Resistance
RDS(on) max.
ID (Silicon Limited)
ID (Package Limited)
45m
27A
Ω
Dynamic dV/dT Rating
175°COperatingTemperature
Fast Switching
Fully Avalanche Rated
Repetitive Avalanche Allowed
up toTjmax
G
20A
S
●
●
Lead-Free,RoHSCompliant
Automotive Qualified *
D
S
Description
G
D-Pak
AUIRFR4105
Specifically designed for Automotive applications,
this cellular design of HEXFET® Power MOSFETs
utilizes the latest processing techniques to achieve
low on-resistance per silicon area. This benefit
combined with the fast switching speed and
ruggedized device design that HEXFET power
MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use
in Automotive and a wide variety of other applications.
G
Gate
D
Drain
S
Source
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Ambient temperature (TA) is 25°C, unless otherwise specified.
Max.
Parameter
Units
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V (Package Limited)
Pulsed Drain Current
27
I
I
I
I
@ T = 25°C
C
D
D
D
19
@ T = 100°C
A
C
20
@ T = 25°C
C
100
DM
68
P
@T = 25°C Power Dissipation
W
W/°C
V
D
C
0.45
Linear Derating Factor
± 20
Gate-to-Source Voltage
V
GS
EAS
IAR
65
Single Pulse Avalanche Energy (Thermally Limited)
Avalanche Current
mJ
A
16
6.8
EAR
dv/dt
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
mJ
V/ns
5.0
-55 to + 175
T
T
Operating Junction and
J
Storage Temperature Range
°C
STG
300
Soldering Temperature, for 10 seconds (1.6mm from case )
Thermal Resistance
Parameter
Typ.
Max.
2.2
Units
Rθ
JC
Rθ
JA
Rθ
JA
Junction-to-Case
–––
–––
–––
Junction-to-Ambient (PCB mount) **
Junction-to-Ambient
50
°C/W
110
www.kersemi.com
1
07/05/11