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AUIRFR4105 PDF预览

AUIRFR4105

更新时间: 2024-11-20 12:53:51
品牌 Logo 应用领域
科盛美 - KERSEMI 晶体晶体管开关脉冲局域网
页数 文件大小 规格书
10页 4784K
描述
Advanced Planar Technology

AUIRFR4105 数据手册

 浏览型号AUIRFR4105的Datasheet PDF文件第2页浏览型号AUIRFR4105的Datasheet PDF文件第3页浏览型号AUIRFR4105的Datasheet PDF文件第4页浏览型号AUIRFR4105的Datasheet PDF文件第5页浏览型号AUIRFR4105的Datasheet PDF文件第6页浏览型号AUIRFR4105的Datasheet PDF文件第7页 
PD - 97597A  
AUTOMOTIVEGRADE  
AUIRFR4105  
HEXFET® Power MOSFET  
Features  
D
V(BR)DSS  
55V  
AdvancedPlanarTechnology  
LowOn-Resistance  
RDS(on) max.  
ID (Silicon Limited)  
ID (Package Limited)  
45m  
27A  
Ω
Dynamic dV/dT Rating  
175°COperatingTemperature  
Fast Switching  
Fully Avalanche Rated  
Repetitive Avalanche Allowed  
up toTjmax  
G
20A  
S
Lead-Free,RoHSCompliant  
Automotive Qualified *  
D
S
Description  
G
D-Pak  
AUIRFR4105  
Specifically designed for Automotive applications,  
this cellular design of HEXFET® Power MOSFETs  
utilizes the latest processing techniques to achieve  
low on-resistance per silicon area. This benefit  
combined with the fast switching speed and  
ruggedized device design that HEXFET power  
MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use  
in Automotive and a wide variety of other applications.  
G
Gate  
D
Drain  
S
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in  
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Max.  
Parameter  
Units  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
27  
I
I
I
I
@ T = 25°C  
C
D
D
D
19  
@ T = 100°C  
A
C
20  
@ T = 25°C  
C
100  
DM  
68  
P
@T = 25°C Power Dissipation  
W
W/°C  
V
D
C
0.45  
Linear Derating Factor  
± 20  
Gate-to-Source Voltage  
V
GS  
EAS  
IAR  
65  
Single Pulse Avalanche Energy (Thermally Limited)  
Avalanche Current  
mJ  
A
16  
6.8  
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
mJ  
V/ns  
5.0  
-55 to + 175  
T
T
Operating Junction and  
J
Storage Temperature Range  
°C  
STG  
300  
Soldering Temperature, for 10 seconds (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
Max.  
2.2  
Units  
Rθ  
JC  
Rθ  
JA  
Rθ  
JA  
Junction-to-Case  
–––  
–––  
–––  
Junction-to-Ambient (PCB mount) **  
Junction-to-Ambient  
50  
°C/W  
110  
www.kersemi.com  
1
07/05/11  

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