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AUIRFR4292TRL PDF预览

AUIRFR4292TRL

更新时间: 2024-11-24 12:53:03
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
14页 262K
描述
Advanced Process Technology

AUIRFR4292TRL 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliantECCN代码:EAR99
Factory Lead Time:16 weeks风险等级:0.92
配置:Single最大漏极电流 (Abs) (ID):9.3 A
FET 技术:METAL-OXIDE SEMICONDUCTOR湿度敏感等级:1
最高工作温度:175 °C峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):100 W
子类别:FET General Purpose Power表面贴装:YES
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

AUIRFR4292TRL 数据手册

 浏览型号AUIRFR4292TRL的Datasheet PDF文件第2页浏览型号AUIRFR4292TRL的Datasheet PDF文件第3页浏览型号AUIRFR4292TRL的Datasheet PDF文件第4页浏览型号AUIRFR4292TRL的Datasheet PDF文件第5页浏览型号AUIRFR4292TRL的Datasheet PDF文件第6页浏览型号AUIRFR4292TRL的Datasheet PDF文件第7页 
PD - 97792  
AUTOMOTIVE GRADE  
AUIRFR4292  
AUIRFU4292  
Features  
HEXFET® Power MOSFET  
Advanced Process Technology  
D
LowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free,RoHSCompliant  
V(BR)DSS  
RDS(on) typ.  
max.  
250V  
275m  
345m  
G
S
ID  
9.3A  
Automotive Qualified *  
Description  
D
SpecificallydesignedforAutomotiveapplications,  
this HEXFET® Power MOSFET utilizes the latest  
processing techniques to achieve extremely low  
on-resistancepersiliconarea. Additionalfeatures  
of this design are a 175°C junction operating  
temperature, fast switching speed and improved  
repetitiveavalancherating. Thesefeaturescom-  
bine to make this design an extremely efficient  
andreliabledeviceforuseinAutomotiveapplica-  
tions and a wide variety of other applications.  
S
S
D
G
G
I-Pak  
AUIRFU4292  
D-Pak  
AUIRFR4292  
G
Gate  
D
Drain  
S
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in  
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Max.  
9.3  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
6.6  
A
40  
PD @TC = 25°C  
Power Dissipation  
100  
0.67  
± 20  
W
W/°C  
V
Linear Derating Factor  
VGS  
EAS  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy (Thermally Limited)  
130  
mJ  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
E
AS (tested )  
97  
IAR  
See Fig.12a, 12b, 15, 16  
A
Repetitive Avalanche Energy  
EAR  
TJ  
mJ  
Operating Junction and  
-55 to + 175  
300  
TSTG  
Storage Temperature Range  
°C  
Soldering Temperature, for 10 seconds (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.5  
Units  
R  
R  
R  
Junction-to-Case  
Junction-to-Ambient (PCB Mount)  
Junction-to-Ambient  
°C/W  
JC  
JA  
JA  
50  
110  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
06/18/12  

AUIRFR4292TRL 替代型号

型号 品牌 替代类型 描述 数据表
AUIRFR4292 INFINEON

完全替代

Advanced Process Technology
AUIRFR4292TRR INFINEON

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Power Field-Effect Transistor, 42A I(D), 55V, 0.011ohm, 1-Element, N-Channel, Silicon, Met