PD - 97681
AUTOMOTIVE GRADE
AUIRFR4620
HEXFET® Power MOSFET
Features
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Advanced Process Technology
D
S
VDSS
200V
64m
78m
24A
Ultra Low On-Resistance
Dynamic dV/dT Rating
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
RDS(on) typ.
G
max.
ID
D
Description
S
Specifically designed for Automotive applications, this HEXFET®
Power MOSFET utilizes the latest processing techniques to achieve
extremely low on-resistance per silicon area. Additional features of
thisdesign area175°Cjunctionoperatingtemperature,fastswitching
speed and improved repetitive avalanche rating . These features
combine to make this design an extremely efficient and reliable
device for use in Automotive applications and a wide variety of other
G
D-Pak
AUIRFR4620
G
Gate
D
S
applications.
Drain
Source
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
Symbol
ID @ TC = 25°C
Parameter
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
Max.
24
Units
A
ID @ TC = 100°C
IDM
17
100
PD @TC = 25°C
W
144
Maximum Power Dissipation
Linear Derating Factor
0.96
W/°C
V
VGS
EAS
IAR
± 20
113
Gate-to-Source Voltage
Single Pulse Avalanche Energy (Thermally limited)
mJ
A
Avalanche Current
See Fig. 14, 15, 22a, 22b,
Repetitive Avalanche Energy
EAR
mJ
54
Peak Diode Recovery
dv/dt
TJ
V/ns
-55 to + 175
Operating Junction and
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
(1.6mm from case)
°C
300
Thermal Resistance
Symbol
Parameter
Typ.
–––
–––
–––
Max.
1.045
50
Units
RθJC
Junction-to-Case
RθJA
RθJA
°C/W
Junction-to-Ambient (PCB Mount)
Junction-to-Ambient
110
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
06/10/11