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2N7336JANTX PDF预览

2N7336JANTX

更新时间: 2024-09-17 12:52:31
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
12页 444K
描述
POWER MOSFET THRU-HOLE (MO-036AB)

2N7336JANTX 数据手册

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PD-90436G  
IRFG6110  
JANTX2N7336  
JANTXV2N7336  
POWER MOSFET  
THRU-HOLE (MO-036AB)  
REF:MIL-PRF-19500/598  
100V, Combination 2N-2P-CHANNEL  
HEXFET® MOSFET TECHNOLOGY  
Product Summary  
Part Number  
IRFG6110  
IRFG6110  
RDS(on)  
0.7Ω  
1.4Ω  
ID  
1.0A  
-0.75A  
CHANNEL  
N
P
HEXFET® MOSFET technology is the key to International  
Rectifier’s advanced line of power MOSFET transistors. The  
efficient geometry design achieves very low on-state resistance  
combined with high transconductance. HEXFET transistors  
also feature all of the well-established advantages of MOSFETs,  
such as voltage control, very fast switching, ease of paralleling  
and electrical parameter temperature stability. They are well-  
suited for applications such as switching power supplies, motor  
controls, inverters, choppers, audio amplifiers, high energy  
pulse circuits, and virtually any application where high reliability  
is required. The HEXFET transistor’s totally isolated package  
eliminates the need for additional isolating material between the  
device and the heatsink. This improves thermal efficiency and  
reduces drain capacitance.  
MO-036AB  
Features:  
n
n
n
n
n
n
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Electrically Isolated  
Dynamic dv/dt Rating  
Light-weight  
Absolute Maximum Ratings (Per Die)  
Parameter  
N-Channel  
1.0  
P-Channel  
-0.75  
-0.5  
Units  
I
@ V  
@ V  
=± 10V, T = 25°C Continuous Drain Current  
D
D
GS  
GS  
C
A
I
=± 10V, T = 100°C Continuous Drain Current  
0.6  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
Linear Derating Factor  
4.0  
-3.0  
DM  
@ T = 25°C  
P
D
1.4  
1.4  
W
W/°C  
V
C
0.011  
±20  
0.011  
±20  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
Avalanche Current À  
GS  
E
75 Á  
1.0  
75 Ä  
-0.75  
0.14  
mJ  
A
AS  
I
AR  
E
AR  
dv/dt  
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt  
Operating Junction  
0.14  
5.5 Â  
mJ  
V/ns  
-5.5 Å  
T
-55 to 150  
J
°C  
g
T
Storage Temperature Range  
STG  
Lead Temperature  
Weight  
300 (0.63 in./1.6 mm from case for 10s)  
1.3 (Typical)  
For footnotes, refer to the last page  
www.irf.com  
1
02/17/10  

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