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TTB001(TE24L,Q)

更新时间: 2024-11-18 21:19:55
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
5页 197K
描述
TRANSISTOR,BJT,PNP,60V V(BR)CEO,3A I(C),SMT

TTB001(TE24L,Q) 技术参数

是否Rohs认证: 符合生命周期:Not Recommended
包装说明:,Reach Compliance Code:unknown
风险等级:5.61最大集电极电流 (IC):3 A
配置:Single最小直流电流增益 (hFE):100
最高工作温度:175 °C极性/信道类型:PNP
最大功率耗散 (Abs):36 W子类别:Other Transistors
表面贴装:YESBase Number Matches:1

TTB001(TE24L,Q) 数据手册

 浏览型号TTB001(TE24L,Q)的Datasheet PDF文件第2页浏览型号TTB001(TE24L,Q)的Datasheet PDF文件第3页浏览型号TTB001(TE24L,Q)的Datasheet PDF文件第4页浏览型号TTB001(TE24L,Q)的Datasheet PDF文件第5页 
TTB001  
TOSHIBA Transistor Silicon PNP Diffused Type  
TTB001  
Audio Frequency Power Amplifier Application  
Unit: mm  
Low collector saturation voltage : V  
= 1.7 V (max)  
CE (sat)  
High power dissipation  
: P = 36 W (Tc = 25°C)  
C
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Collector-base voltage  
Symbol  
Rating  
Unit  
V
CBO  
V
CEO  
V
EBO  
-60  
-60  
V
V
Collector-emitter voltage  
Emitter-base voltage  
-7  
V
A
DC  
I
-3  
C
Collector current (Note1)  
1. Base  
2. N.C.  
3. Emitter  
Pulse  
I
-6  
A
A
CP  
Base current  
I
-0.5  
36  
B
4. Collector (heat sink)  
Collector power dissipation  
Junction temperature (Note 2)  
Tc = 25°C  
P
W
°C  
°C  
C
T
j
175  
-55 to 175  
JEDEC  
JEITA  
T
stg  
Storage temperature range (Note 2)  
TOSHIBA  
2-9F1D  
Note 1: Ensure that the junction temperature does not exceed 175°C  
during use of the device.  
Weight: 0.74 g (typ.)  
Note 2: Junction temperature is guaranteed up to 175°C based on AEC  
Q101.  
Note 3: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
1
2012-03-16  

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