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SI7686DP PDF预览

SI7686DP

更新时间: 2024-09-15 03:32:03
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
7页 110K
描述
N-Channel 30-V (D-S) MOSFET

SI7686DP 数据手册

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Si7686DP  
Vishay Siliconix  
New Product  
N-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
TrenchFETPower MOSFET  
New Low Thermal Resistance PowerPAK  
VDS (V)  
rDS(on) (W)  
ID (A)a  
Qg (Typ)  
Package  
with Low 1.07mm Profile  
Optimized for High-Side Synchronous Rectifier  
Operation  
RoHS  
0.0095 @ V = 10 V  
35  
35  
GS  
COMPLIANT  
30  
9.2 nC  
0.014 @ V = 4.5 V  
GS  
1
0
0
%
R
T
e
s
t
e
d
g
PowerPAK SO-8  
APPLICATIONS  
D
C
/
D
C
C
o
n
v
e
r
t
e
r
s
D
S
6.15 mm  
5.15 mm  
1
S
2
S
3
G
4
G
D
8
D
7
D
6
D
5
S
N-Channel MOSFET  
Bottom View  
Ordering Information: Si7686DP-T1—E3 (Lead (Pb)-Free)  
ABSOLUTE MAXIMUM RATINGS (T = 25C UNLESS OTHERWISE NOTED)  
A
Parameter  
Symbol  
Limit  
30  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
V
DS  
GS  
V
V
"20  
a
T
T
= 25C  
= 70C  
= 25C  
= 70C  
35  
C
a
35  
C
Continuous Drain Current (T = 150C)  
I
D
J
b, c  
T
A
17.9  
b, c  
T
A
14.3  
A
Pulsed Drain Current  
I
50  
DM  
T
= 25C  
= 25C  
= 25C  
= 70C  
= 25C  
= 70C  
31.5  
b, c  
4.2  
C
Continuous Source-Drain Diode Current  
I
S
T
A
T
C
T
C
37.9  
24.2  
b, c  
5
Maximum Power Dissipation  
P
D
W
T
A
b, c  
3.2  
T
A
Operating Junction and Storage Temperature Range  
T , T  
–55 to 150  
260  
J
stg  
C
d, e  
Soldering Recommendations (Peak Temperature)  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
Maximum  
Unit  
b, f  
Maximum Junction-to-Ambient  
R
thJA  
21  
25  
t p 10 sec  
C
/
W
Maximum Junction-to-Case (Drain)  
Steady State  
R
thJC  
2.8  
3.3  
Notes:  
a. Package Limited.  
b. Surface mounted on 1” x 1” FR4 board.  
c. t = 10 sec  
d. See Solder Profile (http://www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper (not  
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure  
adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f.  
Maximum under steady state conditions is 70 C/W.  
Document Number: 73451  
S–51334—Rev. A, 25-Jul-05  
www.vishay.com  
1

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