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SI7703EDN-T1-GE3 PDF预览

SI7703EDN-T1-GE3

更新时间: 2024-09-15 15:51:15
品牌 Logo 应用领域
威世 - VISHAY 开关脉冲晶体管
页数 文件大小 规格书
7页 122K
描述
SINGLE P-CH 20V (D-S) MOSFET+SCHOTTKY - Tape and Reel

SI7703EDN-T1-GE3 技术参数

是否无铅:不含铅生命周期:Obsolete
包装说明:SMALL OUTLINE, S-XDSO-C6针数:8
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.83Is Samacsys:N
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (Abs) (ID):4.3 A
最大漏极电流 (ID):4.3 A最大漏源导通电阻:0.048 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:S-XDSO-C6
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:6
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):2.8 W
最大脉冲漏极电流 (IDM):20 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:MATTE TIN端子形式:C BEND
端子位置:DUAL处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SI7703EDN-T1-GE3 数据手册

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Si7703EDN  
Vishay Siliconix  
Single P-Channel 20 V (D-S) MOSFET With Schottky Diode  
FEATURES  
TrenchFET® Power MOSFETS: 1.8 V Rated  
ESD Protected: 4500 V  
PRODUCT SUMMARY  
VDS (V)  
RDS(on) ()  
ID (A)  
- 6.3  
- 5.3  
- 4.6  
Ultra-Low Thermal Resistance, PowerPAK®  
Package with Low 1.07 mm Profile  
Material categorization:  
0.048 at VGS = - 4.5 V  
0.068 at VGS = - 2.5 V  
0.090 at VGS = - 1.8 V  
- 20  
For definitions of compliance please see  
www.vishay.com/doc?99912  
SCHOTTKY PRODUCT SUMMARY  
APPLICATIONS  
Vf (V)  
Charger Switching  
VKA (V)  
IF (A)  
Diode Forward Voltage  
20  
0.48 V at 0.5 A  
1
PowerPAK 1212-8  
S
K
A
3.30 mm  
3.30 mm  
1
A
2
S
3
G
4
G
K
3 kΩ  
8
K
7
D
6
D
5
D
A
Bottom View  
P-Channel MOSFET  
Ordering Information:  
Si7703EDN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
10 s  
Steady State  
Unit  
VDS  
VKA  
VGS  
Drain-Source Voltage (MOSFET and Schottky)  
Reverse Voltage (Schottky)  
Gate-Source Voltage (MOSFET)  
- 20  
20  
V
12  
- 6.3  
- 4.5  
12  
TA = 25 °C  
TA = 85 °C  
- 4.3  
- 3.1  
- 20  
- 1.1  
1
Continuous Drain Current (TJ = 150 °C) (MOSFET)a  
ID  
IDM  
IS  
IF  
Pulsed Drain Current (MOSFET)  
Continuous Source Current (MOSFET Diode Conduction)a  
Average Foward Current (Schottky)  
A
- 2.3  
IFM  
Pulsed Foward Current (Schottky)  
7
TA = 25 °C  
2.8  
1.5  
2
1.3  
0.7  
1.1  
0.6  
Maximum Power Dissipation (MOSFET)a  
Maximum Power Dissipation (Schottky)a  
TA = 85 °C  
TA = 25 °C  
TA = 85 °C  
PD  
W
1
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendationsb,c  
- 55 to 150  
260  
°C  
Notes:  
a. Surface mounted on 1" x 1" FR4 board.  
b. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
c. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 71429  
S13-0297-Rev. D, 11-Feb-13  
www.vishay.com  
1
For technical questions, contact: pmostechsupport@vishay.com  
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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