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SI7720DN-T1-GE3 PDF预览

SI7720DN-T1-GE3

更新时间: 2024-11-05 12:20:35
品牌 Logo 应用领域
威世 - VISHAY 肖特基二极管
页数 文件大小 规格书
14页 552K
描述
N-Channel 30-V (D-S) MOSFET with Schottky Diode

SI7720DN-T1-GE3 数据手册

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Si7720DN  
Vishay Siliconix  
N-Channel 30-V (D-S) MOSFET with Schottky Diode  
FEATURES  
PRODUCT SUMMARY  
Halogen-free  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)e  
12  
SkyFET™ Monolithic TrenchFET® Power  
MOSFET and Schottky Diode  
Low Thermal Resistance PowerPAK® Package  
with Small Size and Low 1.07 mm Profile  
100 % Rg Tested  
0.0125 at VGS = 10 V  
0.015 at VGS = 4.5 V  
RoHS  
30  
13.7 nC  
12  
COMPLIANT  
PowerPAK 1212-8  
100 % UIS Tested  
APPLICATIONS  
S
3.30 mm  
3.30 mm  
1
S
Notebook PC  
2
S
D
- System Power  
3
G
4
Buck Converter  
Synchronous Rec
D
8
D
7
D
6
D
Schottky Diode  
5
G
Bottom View  
Ordering Information: Si7720DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
S
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
30  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
12e  
12e  
12a, b  
TC = 25 °C  
C = 70 °C  
T
Continuous Drain Current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
10a, b  
A
IDM  
IS  
Pulsed Drain Current  
50  
12e  
3.4a, b  
T
C = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
IAS  
EAS  
20  
20  
52  
L = 0.1 mH  
mJ  
W
T
C = 25 °C  
TC = 70 °C  
A = 25 °C  
TA = 70 °C  
33  
PD  
Maximum Power Dissipation  
3.8a, b  
T
2.4a, b  
- 50 to 150  
260  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)c, d  
°C  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. t = 10 s.  
c. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
d. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
e. Package limited.  
Document Number: 68787  
S-81716-Rev. A, 04-Aug-08  
www.vishay.com  
1

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