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SI7748DP-T1-GE3

更新时间： 2024-11-06 09:25:47
品牌 Logo 应用领域
威世 - VISHAY 肖特基二极管
页数 文件大小 规格书
13页 482K
描述
N-Channel 30-V (D-S) MOSFET with Schottky Diode

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SI7748DP-T1-GE3 数据手册

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New Product  
Si7748DP  
Vishay Siliconix  
N-Channel 30-V (D-S) MOSFET with Schottky Diode  
FEATURES  
PRODUCT SUMMARY  
•
Halogen-free  
SkyFET™ Monolithic TrenchFET®  
Power MOSFET and Schottky Diode  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)a  
50  
•
RoHS  
0.0048 at VGS = 10 V  
0.0066 at VGS = 4.5 V  
COMPLIANT  
30  
27.8 nC  
50  
•
•
100 % Rg Tested  
100 % UIS Tested  
PowerPAK® SO-8  
APPLICATIONS  
•
Notebook  
- Vcore Low-Side  
S
6.15 mm  
5.15 mm  
1
S
D
2
S
3
G
4
D
8
D
7
D
Schottky Diode  
6
D
G
5
N-Channel MOSFET  
Bottom View  
Ordering Information: Si7748DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
S
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
30  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
50a  
50a  
23.5b, c  
18.6b, c  
80  
50a  
4.3b, c  
30  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
L = 0.1 mH  
TC = 25 °C  
IAS  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
EAS  
mJ  
W
45  
56  
TC = 70 °C  
31  
PD  
Maximum Power Dissipation  
4.8b, c  
3b, c  
TA = 25 °C  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
°C  
260  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
Typical  
21  
Maximum  
Unit  
t ≤ 10 s  
26  
°C/W  
Steady State  
RthJC  
1.7  
2.2  
Notes:  
a. Package limited.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 68 °C/W.  
Document Number: 68785  
S-81714-Rev. A, 04-Aug-08  
www.vishay.com  
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