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SI5856DC

更新时间: 2024-02-28 03:15:45
品牌 Logo 应用领域
威世 - VISHAY 肖特基二极管
页数 文件大小 规格书
6页 87K
描述
N-Channel 1.8-V (G-S) MOSFET With Schottky Diode

SI5856DC 数据手册

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Si5856DC  
Vishay Siliconix  
New Product  
N-Channel 1.8-V (G-S) MOSFET With Schottky Diode  
FEATURES  
MOSFET PRODUCT SUMMARY  
D TrenchFETr Power MOSFETS  
D Ultra Low rDS(on)  
VDS (V)  
rDS(on) (W)  
ID (A)  
0.040 @ V = 4.5 V  
GS  
5.9  
5.6  
5.2  
D Ultra Low VF Schottky  
D Si5853DC Pin Compatible  
APPLICATIONS  
20  
0.045 @ V = 2.5 V  
GS  
0.052 @ V = 1.8 V  
GS  
D Buck Rectifier Switch, Buck-Boost  
D Synchronous Rectifier or Load  
D Switch For Portable Devices  
SCHOTTKY PRODUCT SUMMARY  
Vf (V)  
Diode Forward Voltage  
VKA (V)  
IF (A)  
20  
0.375 V @ 1.0  
1.0  
1206-8 ChipFETr  
D
K
1
A
K
A
K
S
Marking Code  
JD XXX  
D
G
G
D
Lot Traceability  
and Date Code  
Part # Code  
Bottom View  
S
A
Ordering Information: Si5856DC-T1  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (T = 25_C UNLESS OTHERWISE NOTED)  
A
Parameter  
Symbol  
5 sec  
Steady State  
Unit  
Drain-Source Voltage (MOSFET and Schottky)  
Reverse Voltage (Schottky)  
V
20  
20  
DS  
V
KA  
V
Gate-Source Voltage (MOSFET)  
V
GS  
"8  
T
= 25_C  
= 85_C  
4.4  
3.1  
5.9  
4.2  
A
a
Continuous Drain Current (T = 150_C) (MOSFET)  
I
J
D
T
A
Pulsed Drain Current (MOSFET)  
I
I
20  
DM  
A
a
Continuous Source Current (MOSFET Diode Conduction)  
Average Foward Current (Schottky)  
I
S
1.8  
0.9  
I
1.0  
7
F
Pulsed Foward Current (Schottky)  
FM  
T
= 25_C  
= 85_C  
= 25_C  
= 85_C  
2.1  
1.1  
1.9  
1.0  
1.1  
0.6  
A
a
Maximum Power Dissipation (MOSFET)  
T
A
P
W
D
T
A
1.1  
a
Maximum Power Dissipation (Schottky)  
T
A
0.56  
Operating Junction and Storage Temperature Range  
T , T  
J
55 to 150  
stg  
_C  
b, c  
Soldering Recommendations (Peak Temperature)  
260  
Notes  
a. Surface Mounted on 1” x 1” FR4 Board.  
b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation  
process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder intercon-  
nection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 72234  
S-32420—Rev. B, 24-Nov-03  
www.vishay.com  
1

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