Datasheet > SCH1UG0124

SCH1UG0124

更新时间： 2024-11-09 12:46:59

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
3页	94K
描述
Current Sensing Bondable Chip Resistors

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获取价格

数据手册

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SCH1UG0124 数据手册

SA, SB, SC

Vishay Sfernice

Current Sensing Bondable

Chip Resistors

FEATURES

• Low ohmic value down to 0.05 Ω

• Tolerance down to 1 %

• Stability 0.1 % < 2000 h at Pn at + 70 °C

• Low noise < 35 dB

• Low TCR 100 ppm/°C

• Wirebondable

This thin film chip resistor fits applications as force balance

scales, E beam deflection systems, switching power

supplies, etc... all rely on current sensors to feed back and

control the current.

Gold pads are compatible with thermosonic or ultrasonic

bonding of gold and aluminium wires.

DIMENSIONS in millimeters

0.4

DIMENSIONS

SERIES DISSIPATION

POWER

1.5

0.5 W

2 W

0.2

0.4

0.5

6 W

ELECTRICAL SPECIFICATIONS

MECHANICAL SPECIFICATIONS

Ohmic values and

associated tolerance:

Substrate:

Alumina

NiCr

0.05 Ω ≤ R < 0.2 Ω 5 %

Resistive element:

Glassivation:

0.2 Ω ≤ R < 0.5 Ω 2 %

0.5 Ω ≤ R < 1 Ω 1 %

higher values and higher

tolerances on request

Ta₂O₅

gold

Bonding pads:

Backside metallization:

on request Ni Au

Power dissipation at + 70 °C: SA: 0.5 W

SB: 2 W

SC: 6 W

ENVIRONMENTAL SPECIFICATIONS

Temperature coefficient:

Noise:

100 ppm/°C

50 ppm/°C on request

Operating

temperature range:

- 55 °C to + 125 °C

- 55 °C to + 155 °C

- 35 dB maximum

Storage temperature:

Low ohmic value chip resistors are also available with

solderable or weldable wraparound terminations.

For standard sizes see our data sheet P Document Number:

53017 and ask us about performance.

* Please see document “Vishay Green and Halogen-Free Definitions (5-2008)” http://www.vishay.com/doc?99902

www.vishay.com

For technical questions, contact: sfer@vishay.com

Document Number: 53013

Revision: 06-Oct-08

12 3

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