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NVMFS6H800NLWFT1G PDF预览

NVMFS6H800NLWFT1G

更新时间: 2024-11-06 02:52:55
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安森美 - ONSEMI /
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7页 204K
描述
Power MOSFET Single N−Channel, 80 V, 1.9 m, 224 A

NVMFS6H800NLWFT1G 数据手册

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NVMFS6H800NL  
Power MOSFET  
Single N−Channel, 80 V, 1.9 mW, 224 A  
Features  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
Low Q and Capacitance to Minimize Driver Losses  
DS(on)  
www.onsemi.com  
G
NVMFS6H800NLWF Wettable Flank Option for Enhanced Optical  
Inspection  
V
R
MAX  
I MAX  
D
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree and are RoHS Compliant  
(BR)DSS  
DS(ON)  
1.9 mW @ 10 V  
2.4 mW @ 4.5 V  
80 V  
224 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
80  
Unit  
V
V
DSS  
D (5,6)  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
224  
158  
214  
107  
30  
A
C
D
q
JC  
T
C
(Notes 1, 3)  
Steady  
State  
G (4)  
Power Dissipation  
T
C
P
W
A
D
R
(Note 1)  
q
JC  
T
C
= 100°C  
S (1,2,3)  
NCHANNEL MOSFET  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
q
JA  
T = 100°C  
A
21  
(Notes 1, 2, 3)  
Steady  
State  
Power Dissipation  
T = 25°C  
A
P
3.9  
1.9  
900  
W
D
MARKING  
DIAGRAM  
R
(Notes 1, 2)  
q
JA  
T = 100°C  
A
D
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
1
S
S
S
G
D
D
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
°C  
J
stg  
DFN5  
(SO8FL)  
CASE 488AA  
STYLE 1  
XXXXXX  
AYWZZ  
+175  
Source Current (Body Diode)  
I
S
179  
601  
A
D
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I  
= 16.2 A)  
XXXXXX = 6H800L  
L(pk)  
XXXXXX = (NVMFS6H800NL) or  
XXXXXX = 800LWF  
XXXXXX = (NVMFS6H800NLWF)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
A
Y
W
ZZ  
= Assembly Location  
= Year  
= Work Week  
= Lot Traceability  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
0.7  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
R
39  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
April, 2019 Rev. 2  
NVMFS6H800NL/D  
 

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