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NVMFS6D1N08HT1G PDF预览

NVMFS6D1N08HT1G

更新时间: 2024-11-06 11:14:19
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
9页 310K
描述
Power MOSFET - 80 V, 5.5 mΩ, 89 A, Single N−Channel

NVMFS6D1N08HT1G 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET - Power, Single  
N-Channel  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
80 V  
5.5 mW @ 10 V  
89 A  
80 V, 5.5 mW, 89 A  
D (5,6)  
NVMFS6D1N08H  
Features  
Small Footprint (5x6 mm) for Compact Design  
G (4)  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
S (1,2,3)  
NCHANNEL MOSFET  
NVMFSW6D1N08H Wettable Flank Option for Enhanced Optical  
Inspection  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree, Halogen Free/BFR Free, Beryllium Free  
and are RoHS Compliant  
Typical Applications  
1
Synchronous Rectification  
ACDC and DCDC Power Supplies  
ACDC Adapters (USB PD) SR  
Load Switch  
DFN5  
(SO8FL)  
CASE 488AA  
STYLE 1  
DFNW5  
(FULLCUT SO8FL WF)  
CASE 507BA  
MARKING DIAGRAM  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
80  
Unit  
V
D
V
DSS  
S
S
S
G
D
D
XXXXXX  
AYWZZ  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Steady  
State  
T
=
I
D
89  
A
C
25°C  
Current R  
(Note 1)  
q
JC  
D
Power Dissipation R  
(Note 1)  
P
104  
17  
W
A
q
D
JC  
JA  
XXXXXX = 6D1N08  
XXXXXX = (NVMFS6D1N08H) or  
XXXXXX = W6D1N8  
Continuous Drain  
Current R  
Steady  
State  
T =  
I
D
A
25°C  
q
JA  
(Notes 1, 2)  
XXXXXX = (NVMFSW6D1N08H)  
A
Y
= Assembly Location  
= Year  
Power Dissipation R  
(Notes 1, 2)  
P
D
3.8  
W
q
W
ZZ  
= Work Week  
= Lot Traceability  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
468  
A
A
p
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
ORDERING INFORMATION  
Source Current (Body Diode)  
I
S
87  
A
See detailed ordering, marking and shipping information in the  
package dimensions section on page 6 of this data sheet.  
Single Pulse DraintoSource Avalanche  
E
AS  
465  
mJ  
Energy (I = 5.9 A)  
AV  
Lead Temperature Soldering Reflow for  
Soldering Purposes (1/8from case for 10 s)  
T
L
300  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
May, 2022 Rev. 1  
NVMFS6D1N08H/D  

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