DATA SHEET
www.onsemi.com
MOSFET – Power, Single
N-Channel
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
27.5 mW @ 10 V
43.0 mW @ 4.5 V
60 V
21 A
60 V, 27.5 mW, 21 A
N−Channel
D (5 − 8)
NVMFS5C680NL
Features
Small Footprint (5 x 6 mm) for Compact Design
Low R
to Minimize Conduction Losses
DS(on)
G (4)
Low Capacitance to Minimize Driver Losses
NVMFS5C680NLWF − Wettable Flanks Product
AEC−Q101 Qualified and PPAP Capable
S (1, 2, 3)
These Devices are Pb−Free and are RoHS Compliant
MARKING
DIAGRAMS
MAXIMUM RATINGS (T = 25C unless otherwise noted)
J
D
Parameter
Drain−to−Source Voltage
Symbol
Value
60
Unit
V
1
S
S
S
G
D
D
V
DSS
DFN5
XXXXXX
AYWZZ
Gate−to−Source Voltage
V
GS
20
21
V
(SO−8FL)
CASE 488AA
STYLE 1
Continuous Drain
Current R
I
D
A
T
= 25C
C
D
q
JC
T
C
= 100C
15
(Notes 1, 2, 3, 4)
Steady
State
Power Dissipation
P
D
W
A
T
C
= 25C
24
12
1
R
(Notes 1, 2, 3)
q
JC
T
C
= 100C
XXXXXX
AYWZZ
Continuous Drain
Current R
I
D
T = 25C
A
8.1
DFNW5
(FULL−CUT SO8FL WF)
q
JA
T = 100C
A
5.7
(Notes 1 & 3, 4)
Steady
State
CASE 507BA
Power Dissipation
P
D
W
T = 25C
A
3.4
1.7
87
R
(Notes 1, 3)
q
JA
T = 100C
A
Pulsed Drain Current
T = 25C, t = 10 ms
A
I
DM
A
XXXXXX = 5C680L (NVMFS5C680NL) or
680LWF (NVMFS5C680NLWF)
p
Operating Junction and Storage Temperature
T , T
−55 to
+175
C
J
stg
A
Y
W
ZZ
= Assembly Location
= Year
= Work Week
= Lot Traceability
Source Current (Body Diode)
I
S
20
A
Single Pulse Drain−to−Source Avalanche
E
AS
44.6
mJ
Energy (I
= 1.5 A)
L(pk)
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)
T
L
260
C
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)
Parameter
Symbol
Value
6.3
Unit
Junction−to−Case − Steady State (Note 3)
Junction−to−Ambient − Steady State (Note 3)
R
C/W
q
JC
R
44
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Psi (Y) is used as required per JESD51−12 for packages in which
substantially less than 100% of the heat flows to single case surface.
2
3. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
4. Continuous DC current rating. Maximum current for pulses as long as 1
second is higher but is dependent on pulse duration and duty cycle.
Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
September, 2022 − Rev. 1
NVMFS5C680NL/D