NVMFS5H615NL,
NVMFS5H615NLWF
Power MOSFET
60 V, 1.8 mW, 203 A, Single N−Channel
NVMFS5H615NLWF − Wettable Flank
Option for Enhanced Optical Inspection
www.onsemi.com
Features
• Small Footprint (5x6 mm) for Compact Design
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
• Low R
to Minimize Conduction Losses
DS(on)
1.8 mW @ 10 V
2.5 mW @ 4.5 V
60 V
203 A
• Low Q and Capacitance to Minimize Driver Losses
G
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
D (5)
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
60
Unit
V
V
DSS
G (4)
Gate−to−Source Voltage
V
GS
20
V
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
203
143
167
83
A
C
D
S (1,2,3)
N−CHANNEL MOSFET
q
JC
T
C
(Notes 1, 3)
Steady
State
Power Dissipation
T
C
P
W
A
D
R
(Note 1)
q
JC
T
C
= 100°C
MARKING
DIAGRAM
Continuous Drain
Current R
T = 25°C
A
I
D
31
q
JA
T = 100°C
A
22
D
(Notes 1, 2, 3)
Steady
State
1
S
S
S
G
D
D
Power Dissipation
T = 25°C
A
P
3.9
1.9
900
W
D
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
XXXXXX
AYWZZ
R
(Notes 1, 2)
q
JA
T = 100°C
A
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
D
Operating Junction and Storage Temperature
Range
T , T
−55 to
+175
°C
J
stg
XXXXXX = 5H615L (NVMFS5H615NL) or
= 615LWF (NVMFS5H615NLWF)
= Assembly Location
= Year
= Work Week
= Lot Traceability
Source Current (Body Diode)
I
139
419
A
S
A
Y
W
ZZ
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
Energy (I
= 16 A)
L(pk)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
L
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
0.9
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
39
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
November, 2018 − Rev. 0
NVMFS5H615NL/D