NVMFS6B14NL
Power MOSFET
100 V, 13 mW, 55 A, Single N−Channel
Features
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
• Low Q and Capacitance to Minimize Driver Losses
DS(on)
www.onsemi.com
G
• NVMFS6B14NLWF − Wettable Flank Option for Enhanced Optical
Inspection
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
13 mW @ 10 V
19 mW @ 4.5 V
100 V
55 A
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
100
16
Unit
V
D (5,6)
V
DSS
Gate−to−Source Voltage
Continuous Drain Cur-
V
GS
V
T
= 25°C
= 100°C
= 25°C
I
D
55
A
C
rent R
(Notes 1, 3)
q
JC
T
C
39
Steady
State
G (4)
Power Dissipation R
(Note 1)
T
C
P
D
94
W
A
q
JC
T
C
= 100°C
47
S (1,2,3)
N−CHANNEL MOSFET
Continuous Drain Cur-
rent R (Notes 1, 2, 3)
T = 25°C
A
I
D
11
q
JA
T = 100°C
A
8.0
3.8
1.9
140
Steady
State
Power Dissipation R
(Notes 1 & 2)
T = 25°C
A
P
D
W
q
JA
MARKING
DIAGRAM
T = 100°C
A
Pulsed Drain Current
T = 25°C, t = 10 ms
A
I
DM
A
p
D
1
Operating Junction and Storage Temperature
T , T
−55 to
+ 175
°C
J
stg
S
S
S
G
D
D
XXXXXX
AYWZZ
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
Source Current (Body Diode)
I
S
60
29
A
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
D
Energy (I
= 24 A)
L(pk)
XXXXXX = 6B14NL
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
L
(NVMFS6B14NL) or
6B14LW
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
(NVMFS6B14NLWF)
= Assembly Location
= Year
A
Y
THERMAL RESISTANCE MAXIMUM RATINGS
W
ZZ
= Work Week
= Lot Traceability
Parameter
Symbol
Value
1.6
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
JA
R
40
ORDERING INFORMATION
q
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
2
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
January, 2016 − Rev. 1
NVMFS6B14NL/D