NVMFS5H663NL,
NVMFS5H663NLWF
MOSFET – Power, Single
N-Channel
60 V, 7.2 mW, 67 A
www.onsemi.com
NVMFS5H663NLWF − Wettable Flank Option for Enhanced
Optical Inspection.
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
Features
• Small Footprint (5x6 mm) for Compact Design
7.2 mW @ 10 V
10 mW @ 4.5 V
60 V
67 A
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
G
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
D (5)
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
60
Unit
V
G (4)
V
DSS
Gate−to−Source Voltage
V
GS
20
V
S (1,2,3)
N−CHANNEL MOSFET
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
67
A
C
D
q
JC
T
C
47
(Notes 1, 3)
Steady
State
Power Dissipation
T
C
P
63
W
A
D
R
(Note 1)
q
JC
MARKING
DIAGRAM
T
C
= 100°C
31.3
16.2
11.4
3.7
Continuous Drain
Current R
T = 25°C
A
I
D
D
q
JA
1
T = 100°C
A
S
S
S
G
D
D
(Notes 1, 2, 3)
Steady
State
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
XXXXXX
AYWZZ
Power Dissipation
T = 25°C
A
P
W
D
R
(Notes 1 & 2)
q
JA
T = 100°C
A
1.8
D
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
359
A
A
p
5H663L = (NVMFS5H663NL) or
663LWF = (NVMFS5H663NLWF)
Operating Junction and Storage Temperature
T , T
−55 to
°C
J
stg
+175
A
= Assembly Location
= Year
Source Current (Body Diode)
I
S
52
A
Y
W
ZZ
= Work Week
= Lot Traceability
Single Pulse Drain−to−Source Avalanche
E
AS
274
mJ
Energy (I
= 3.8 A)
L(pk)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
2.4
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
41
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
July, 2019 − Rev. 2
NVMFS5H663NL/D