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NTVS3141P_09 PDF预览

NTVS3141P_09

更新时间: 2024-11-14 06:00:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 127K
描述
−20 V, −3.7 A, 85 m, Single P−Channel, CSP 1.0x1.5x0.65 mm

NTVS3141P_09 数据手册

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NTVS3141P  
Power MOSFET  
20 V, 3.7 A, 85 mW, Single PChannel,  
CSP 1.0x1.5x0.65 mm  
Features  
Low R  
at Low Gate Voltage  
http://onsemi.com  
DS(on)  
Chip Scale Packaging  
2
V
R
MAX  
I MAX  
D
(Note 1)  
High Power Density (A/mm )  
This is a PbFree Device  
(BR)DSS  
DS(ON)  
85 mΩ @ 4.5 V  
123 mΩ @ 2.5 V  
150 mΩ @ 1.8 V  
200 mΩ @ 1.5 V  
Applications  
Load Switch in Cell Phone, DSC, PMP, GPS, PC’s  
Battery Charging Switch  
20 V  
3.7 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
DraintoSource Voltage  
GatetoSource Voltage  
Symbol  
Value  
20  
Unit  
V
S
V
DSS  
V
GS  
"8  
V
G
Continuous Drain  
Current (Note 1)  
Steady  
State  
I
D
3.7  
A
T = 25°C  
A
Continuous Drain  
Current (Note 2)  
Steady  
State  
I
D
2.9  
A
T = 25°C  
A
D
Power Dissipation Steady  
(Note 1) State  
P
P
1.5  
0.9  
W
W
D
T = 25°C  
A
PChannel MOSFET  
Power Dissipation Steady  
D
T = 25°C  
A
(Note 2)  
State  
Pulsed Drain Current  
t = 10 ms  
p
I
15  
A
DM  
A1  
Operating Junction and Storage  
Temperature  
T , T  
55 to 150  
°C  
J
STG  
6 PIN FLIPCHIP  
1.0 x 1.5  
Source Current (Body Diode)  
I
S
1.1  
A
CASE 499BC  
Lead Temperature for Soldering Purposes  
(IR/Convection)  
T
250  
°C  
L
PIN CONNECTION AND MARKING  
DIAGRAM  
THERMAL RESISTANCE RATINGS  
Rating  
Symbol  
Max  
Unit  
JunctiontoAmbient – Steady State  
(Note 1)  
R
83  
°C/W  
θ
JA  
JunctiontoAmbient – Steady State  
(Note 2)  
R
133  
°C/W  
θ
JA  
1. Surfacemounted on FR4 board using 1 inch sq pad size  
3141 = Specific Device Code  
WW = Work Week  
(Cu area = 1 in sq [2 oz] including traces)  
2. Surfacemounted on FR4 board using 77.3 sq mm min pad, 2 oz Cu.  
ORDERING INFORMATION  
Device  
NTVS3141PT2G  
Package  
Shipping  
3000/Tape & Reel  
CSP6  
(PbFree)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
March, 2009 Rev. 0  
NTVS3141P/D  
 

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