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NTZD3152P PDF预览

NTZD3152P

更新时间: 2024-11-15 06:00:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 98K
描述
Small Signal MOSFET −20 V, −430 mA, Dual P−Channel with ESD Protection, SOT−563

NTZD3152P 数据手册

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NTZD3152P  
Small Signal MOSFET  
20 V, 430 mA, Dual PChannel  
with ESD Protection, SOT563  
Features  
http://onsemi.com  
Low R  
Improving System Efficiency  
DS(on)  
V
R
Typ  
I Max  
D
(BR)DSS  
DS(on)  
Low Threshold Voltage  
ESD Protected Gate  
0.5 W @ 4.5 V  
0.6 W @ 2.5 V  
20 V  
430 mA  
Small Footprint 1.6 x 1.6 mm  
These are PbFree Devices  
1.0 W @ 1.8 V  
D
D
2
1
Applications  
Load/Power Switches  
G
G
Power Supply Converter Circuits  
Battery Management  
2
1
Cell Phones, Digital Cameras, PDAs, Pagers, etc.  
PChannel  
MOSFET  
S
2
S
1
MAXIMUM RATINGS (T = 25°C unless otherwise noted.)  
J
MARKING DIAGRAM  
6
Parameter  
DraintoSource Voltage  
Symbol Value Unit  
V
20  
6.0  
V
V
DSS  
1
TU M G  
SOT5636  
CASE 463A  
GatetoSource Voltage  
V
GS  
G
1
Continuous Drain Current  
T = 25°C  
430  
mA  
A
Steady  
State  
TU  
M
G
= Specific Device Code  
= Date Code  
= PbFree Package  
I
D
T = 85°C  
A
310  
(Note 1)  
Power Dissipation  
(Note 1)  
Steady State  
P
250  
mW  
mA  
D
(Note: Microdot may be in either location)  
PINOUT: SOT563  
Continuous Drain Current  
(Note 1)  
T = 25°C  
A
455  
328  
280  
t v 5 s  
I
D
T = 85°C  
A
S
1
2
3
6
5
D
1
1
Power Dissipation  
(Note 1)  
t v 5 s  
P
D
mW  
Pulsed Drain Current  
t = 10 ms  
I
750  
mA  
p
DM  
G
G
2
1
2
Operating Junction and Storage Temperature  
T ,  
STG  
55 to  
150  
°C  
J
T
Source Current (Body Diode)  
I
S
350  
mA  
4
S
2
D
Lead Temperature for Soldering Purposes  
T
L
260  
°C  
(1/8from case for 10 s)  
Top View  
THERMAL RESISTANCE RATINGS  
ORDERING INFORMATION  
Parameter  
Symbol  
Max  
500  
447  
Unit  
Device  
Package  
Shipping  
JunctiontoAmbient – Steady State (Note 1)  
JunctiontoAmbient – t v 5 s (Note 1)  
°C/W  
R
q
JA  
NTZD3152PT1G  
NTZD3152PT1H  
NTZD3152PT5G  
NTZD3152PT5H  
SOT563  
(PbFree)  
4000 / Tape & Reel  
8000 / Tape & Reel  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 in. sq. pad size  
SOT563  
(PbFree)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
(Cu. area = 1.127 in. sq. [1 oz.] including traces).  
© Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
March, 2010 Rev. 2  
NTZD3152P/D  
 

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