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NTZD3158P PDF预览

NTZD3158P

更新时间: 2024-11-16 01:21:59
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 110K
描述
Dual P−Channel Small Signal MOSFET

NTZD3158P 数据手册

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NTZD3158P  
Small Signal MOSFET  
20 V, 430 mA, Dual PChannel  
with ESD Protection, SOT563  
Features  
http://onsemi.com  
Low R  
Improving System Efficiency  
DS(on)  
Low Threshold Voltage  
V
R
Typ  
I Max  
D
(BR)DSS  
DS(on)  
ESD Protected Gate  
0.5 W @ 4.5 V  
0.6 W @ 2.5 V  
Small Footprint 1.6 x 1.6 mm  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
20 V  
430 mA  
1.0 W @ 1.8 V  
D
D
2
1
Applications  
Load/Power Switches  
G
G
2
1
Power Supply Converter Circuits  
Battery Management  
Cell Phones, Digital Cameras, PDAs, Pagers, etc.  
PChannel  
MOSFET  
S
2
S
1
MAXIMUM RATINGS (T = 25°C unless otherwise noted.)  
J
MARKING DIAGRAM  
6
Parameter  
DraintoSource Voltage  
Symbol Value Unit  
1
V
DSS  
20  
6.0  
V
V
TJ M G  
SOT5636  
CASE 463A  
G
GatetoSource Voltage  
V
GS  
1
Continuous Drain Current  
T = 25°C  
430  
mA  
A
TJ  
M
G
= Specific Device Code  
= Date Code  
= PbFree Package  
Steady  
State  
I
D
T = 85°C  
A
310  
(Note 1)  
Power Dissipation  
(Note 1)  
Steady State  
P
D
250  
mW  
mA  
(Note: Microdot may be in either location)  
PINOUT: SOT563  
Continuous Drain Current  
(Note 1)  
T = 25°C  
455  
328  
280  
A
t v 5 s  
I
D
T = 85°C  
A
S
1
2
3
6
5
D
1
Power Dissipation  
(Note 1)  
t v 5 s  
P
D
mW  
1
Pulsed Drain Current  
t = 10 ms  
p
I
750  
mA  
DM  
G
G
Operating Junction and Storage Temperature  
T ,  
STG  
55 to  
150  
°C  
2
1
2
J
T
Source Current (Body Diode)  
I
S
350  
mA  
4
S
2
D
Lead Temperature for Soldering Purposes  
T
L
260  
°C  
(1/8from case for 10 s)  
THERMAL RESISTANCE RATINGS  
Top View  
Parameter  
Symbol  
Max  
500  
447  
Unit  
JunctiontoAmbient – Steady State (Note 1)  
JunctiontoAmbient – t v 5 s (Note 1)  
°C/W  
ORDERING INFORMATION  
R
q
JA  
Device  
NTZD3158PT1G  
Package  
Shipping  
SOT563  
(PbFree)  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 in. sq. pad size  
4000 / Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
(Cu. area = 1.127 in. sq. [1 oz.] including traces).  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
April, 2013 Rev. 0  
NTZD3158P/D  
 

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