NTZD3158P
Small Signal MOSFET
−20 V, −430 mA, Dual P−Channel
with ESD Protection, SOT−563
Features
http://onsemi.com
• Low R
Improving System Efficiency
DS(on)
• Low Threshold Voltage
V
R
Typ
I Max
D
(BR)DSS
DS(on)
• ESD Protected Gate
0.5 W @ −4.5 V
0.6 W @ −2.5 V
• Small Footprint 1.6 x 1.6 mm
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
−20 V
−430 mA
1.0 W @ −1.8 V
D
D
2
1
Applications
• Load/Power Switches
G
G
2
1
• Power Supply Converter Circuits
• Battery Management
• Cell Phones, Digital Cameras, PDAs, Pagers, etc.
P−Channel
MOSFET
S
2
S
1
MAXIMUM RATINGS (T = 25°C unless otherwise noted.)
J
MARKING DIAGRAM
6
Parameter
Drain−to−Source Voltage
Symbol Value Unit
1
V
DSS
−20
6.0
V
V
TJ M G
SOT−563−6
CASE 463A
G
Gate−to−Source Voltage
V
GS
1
Continuous Drain Current
T = 25°C
−430
mA
A
TJ
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
Steady
State
I
D
T = 85°C
A
−310
(Note 1)
Power Dissipation
(Note 1)
Steady State
P
D
250
mW
mA
(Note: Microdot may be in either location)
PINOUT: SOT−563
Continuous Drain Current
(Note 1)
T = 25°C
−455
−328
280
A
t v 5 s
I
D
T = 85°C
A
S
1
2
3
6
5
D
1
Power Dissipation
(Note 1)
t v 5 s
P
D
mW
1
Pulsed Drain Current
t = 10 ms
p
I
−750
mA
DM
G
G
Operating Junction and Storage Temperature
T ,
STG
−55 to
150
°C
2
1
2
J
T
Source Current (Body Diode)
I
S
−350
mA
4
S
2
D
Lead Temperature for Soldering Purposes
T
L
260
°C
(1/8″ from case for 10 s)
THERMAL RESISTANCE RATINGS
Top View
Parameter
Symbol
Max
500
447
Unit
Junction−to−Ambient – Steady State (Note 1)
Junction−to−Ambient – t v 5 s (Note 1)
°C/W
ORDERING INFORMATION
R
q
JA
†
Device
NTZD3158PT1G
Package
Shipping
SOT−563
(Pb−Free)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in. sq. pad size
4000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
(Cu. area = 1.127 in. sq. [1 oz.] including traces).
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
April, 2013 − Rev. 0
NTZD3158P/D