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NTZD3154NT2G

更新时间: 2024-11-16 11:01:35
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 140K
描述
双 N 沟道,小信号 MOSFET,20V,540mA,550mΩ

NTZD3154NT2G 数据手册

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NTZD3154N  
Small Signal MOSFET  
20 V, 540 mA, Dual NChannel  
Features  
Low R  
Improving System Efficiency  
http://onsemi.com  
DS(on)  
Low Threshold Voltage  
Small Footprint 1.6 x 1.6 mm  
ESD Protected Gate  
V
R
Typ  
I Max (Note 1)  
D
(BR)DSS  
DS(on)  
400 mW @ 4.5 V  
500 mW @ 2.5 V  
20  
540 mA  
These are PbFree Devices  
700 mW @ 1.8 V  
Applications  
Load/Power Switches  
D1  
D2  
Power Supply Converter Circuits  
Battery Management  
Cell Phones, Digital Cameras, PDAs, Pagers, etc.  
G1  
G2  
MAXIMUM RATINGS (T = 25°C unless otherwise noted.)  
J
NChannel  
MOSFET  
Parameter  
DraintoSource Voltage  
Symbol Value Unit  
S1  
1
S2  
V
DSS  
20  
V
V
MARKING  
DIAGRAM  
GatetoSource Voltage  
V
GS  
6.0  
Continuous Drain Current  
(Note 1)  
T = 25°C  
540  
390  
250  
mA  
A
Steady  
State  
6
I
D
T = 85°C  
A
TV M G  
Power Dissipation  
(Note 1)  
P
D
mW  
mA  
G
SOT5636  
CASE 463A  
Steady State  
Continuous Drain Current  
(Note 1)  
T = 25°C  
570  
410  
280  
A
TV  
M
G
= Specific Device Code  
= Date Code  
= PbFree Package  
t v 5 s  
I
D
T = 85°C  
A
Power Dissipation  
(Note 1)  
P
mW  
D
t v 5 s  
t = 10 ms  
(Note: Microdot may be in either location)  
Pulsed Drain Current  
I
1.5  
A
p
DM  
PINOUT: SOT563  
Operating Junction and Storage Temperature  
T ,  
STG  
55 to  
150  
°C  
J
T
S
1
2
3
6
5
D
1
Source Current (Body Diode)  
I
350  
260  
mA  
1
S
Lead Temperature for Soldering Purposes  
T
°C  
L
(1/8from case for 10 s)  
G
G
2
1
2
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Max  
Unit  
JunctiontoAmbient – Steady State  
500  
°C/W  
4
S
2
D
(Note 1)  
R
q
JA  
JunctiontoAmbient – t v 5 s (Note 1)  
447  
Top View  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 in sq pad size  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
(Cu. area = 1.127 in sq [1 oz] including traces).  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
March, 2006 Rev. 1  
NTZD3154N/D  

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