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NTZD3155C

更新时间： 2024-11-15 06:00:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 112K
描述
Small Signal MOSFET Complementary 20 V, 540 mA / -430 mA, with ESD protection, SOT-563 package.

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NTZD3155C 数据手册

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NTZD3155C  
Small Signal MOSFET  
Complementary 20 V, 540 mA / -430 mA,  
with ESD protection, SOT-563 package.  
Features  
http://onsemi.com  
•ꢀLeading Trench Technology for Low RDS(on) Performance  
•ꢀHigh Efficiency System Performance  
•ꢀLow Threshold Voltage  
I
Max  
(Note 1)  
D
V
R
Typ  
DS(on)  
(BR)DSS  
0.4 W @ 4.5 V  
0.5 W @ 2.5 V  
N-Channel  
20 V  
•ꢀESD Protected Gate  
540 mA  
•ꢀSmall Footprint 1.6 x 1.6 mm  
•ꢀThese are Pb-Free Devices  
0.7 W @ 1.8 V  
0.5 W @ -4.5 V  
0.6 W @ -2.5 V  
1.0 W @ -1.8 V  
P-Channel  
-20 V  
-430 mA  
Applications  
•ꢀDC-DC Conversion Circuits  
•ꢀLoad/Power Switching with Level Shift  
•ꢀSingle or Dual Cell Li-Ion Battery Operated Systems  
•ꢀHigh Speed Circuits  
PINOUT: SOT-563  
S
1
G
1
D
2
1
6
5
4
D
1
•ꢀCell Phones, MP3s, Digital Cameras, and PDAs  
MAXIMUM RATINGS (T = 25°C unless otherwise specified)  
J
2
3
G
2
Parameter  
Drain-to-Source Voltage  
Symbol Value Unit  
V
DSS  
20  
6
V
V
S
2
Gate-to-Source Voltage  
V
GS  
N-Channel  
Continuous Drain  
Current (Note 1)  
T = 25°C  
540  
390  
570  
-430  
-310  
-455  
250  
A
Steady  
State  
Top View  
T = 85°C  
A
t v 5 s  
T = 25°C  
A
MARKING  
DIAGRAM  
I
mA  
D
6
P-Channel  
Continuous Drain  
Current (Note 1)  
T = 25°C  
A
Steady  
State  
1
T = 85°C  
A
TW MꢀG  
SOT-563-6  
CASE 463A  
t v 5 s  
T = 25°C  
A
G
Power Dissipation  
(Note 1)  
Steady  
State  
TW  
M
= Specific Device Code  
= Date Code  
= Pb-Free Package  
T = 25°C  
A
P
mW  
D
t v 5 s  
280  
1500  
-750  
G
Pulsed Drain Current N-Channel  
P-Channel  
(Note: Microdot may be in either location)  
t = 10 ms  
p
I
mA  
DM  
ORDERING INFORMATION  
Operating Junction and Storage Temperature  
T ,  
J
-55 to  
150  
°C  
T
STG  
†
Device  
Package  
Shipping  
Source Current (Body Diode)  
I
350  
260  
mA  
S
NTZD3155CT1G SOT-563 4000 / Tape & Reel  
(Pb-Free)  
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
°C  
T
L
NTZD3155CT2G SOT-563 4000 / Tape & Reel  
(Pb-Free)  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface-mounted on FR4 board using 1 in sq. pad size  
NTZD3155CT5G SOT-563 8000 / Tape & Reel  
(Pb-Free)  
(Cu area = 1.127 in sq [1 oz] including traces).  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
©ꢀ Semiconductor Components Industries, LLC, 2007  
May, 2007 - Rev. 2  
1
Publication Order Number:  
NTZD3155C/D  
 
12345678

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