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NTY100N10_06 PDF预览

NTY100N10_06

更新时间: 2024-10-02 06:00:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 158K
描述
Power MOSFET 123 A, 100 V N−Channel Enhancement−Mode TO264 Package

NTY100N10_06 数据手册

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NTY100N10  
Preferred Device  
Power MOSFET 123 A,  
100 V N−Channel  
Enhancement−Mode TO264  
Package  
http://onsemi.com  
Features  
123 A, 100 V  
9 mW @ VGS = 10 V (Typ)  
SourcetoDrain Diode Recovery Time Comparable to a Discrete  
Fast Recovery Diode  
Avalanche Energy Specified  
IDSS and R  
Specified at Elevated Temperature  
PbFree Package is Available*  
DS(on)  
NChannel  
D
Applications  
PWM Motor Control  
Power Supplies  
Converters  
G
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
MARKING DIAGRAM &  
PIN ASSIGNMENT  
Rating  
DrainSource Voltage  
Symbol Value  
Unit  
V
V
100  
100  
DSS  
DGR  
DrainGate Voltage (R = 1 MW)  
V
V
V
GS  
GateSource Voltage  
Continuous  
V
$20  
$40  
V
V
GS  
GSM  
NTY100N10  
AYYWWG  
NonRepetitive (t v 10 ms)  
p
1
2
Drain Current (Note 1)  
A
A
3
Continuous @ T = 25°C  
I
123  
369  
C
D
TO264  
CASE 340G  
STYLE 1  
Pulsed  
I
DM  
Total Power Dissipation (Note 1)  
Derate above 25°C  
P
D
313  
2.5  
Watts  
W/°C  
1
G
2
D
3
S
Operating and Storage Temperature Range  
T , T  
55 to  
°C  
J
stg  
A
= Assembly Location  
= Year  
= Work Week  
150  
YY  
WW  
G
Single Pulse DraintoSource  
E
AS  
500  
mJ  
= PbFree Package  
Avalanche Energy Starting T = 25°C  
J
(V = 80 Vdc, V = 10 Vdc,  
DD  
GS  
Peak I = 100 Apk, L = 0.1 mH, R = 25 W)  
L
G
ORDERING INFORMATION  
Thermal Resistance  
Junction to Case  
R
R
0.4  
25  
°C/W  
°C  
q
JC  
Junction to Ambient  
q
JA  
Device  
Package  
Shipping  
25 Units/Rail  
25 Units/Rail  
Maximum Lead Temperature for Soldering  
Purposes, 0.125 in from case for 10 seconds  
T
260  
NTY100N10  
TO264  
L
NTY100N10G  
TO264  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
RecommendedOperating Conditions may affect device reliability.  
(PbFree)  
1. Pulse Test: Pulse Width = 10 ms, DutyCycle = 2%.  
Preferred devices are recommended choices for future use  
and best overall value.  
*For additional information on our PbFree strategy and soldering details, please  
downloadthe ON Semiconductor Soldering and Mounting Techniques Reference  
Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
March, 2006 Rev. 2  
NTY100N10/D  

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