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NTMSD3P102R2_06 PDF预览

NTMSD3P102R2_06

更新时间: 2024-02-14 21:45:13
品牌 Logo 应用领域
安森美 - ONSEMI 肖特基二极管
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9页 179K
描述
P-Channel Enhancement-Mode Power MOSFET and Schottky Diode Dual Dual SO-8 Package

NTMSD3P102R2_06 数据手册

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NTMSD3P102R2  
FETKY  
PChannel EnhancementMode  
Power MOSFET and Schottky Diode  
Dual SO8 Package  
Features  
High Efficiency Components in a Single SO8 Package  
http://onsemi.com  
High Density Power MOSFET with Low RDS(on)  
,
Schottky Diode with Low VF  
MOSFET  
3.05 AMPERES  
20 VOLTS  
Independent PinOuts for MOSFET and Schottky Die  
Allowing for Flexibility in Application Use  
Less Component Placement for Board Space Savings  
0.085 W @ V = 10 V  
GS  
SO8 Surface Mount Package,  
Mounting Information for SO8 Package Provided  
SCHOTTKY DIODE  
1.0 AMPERE  
20 VOLTS  
PbFree Packages are Available  
Applications  
DCDC Converters  
470 mV @ I = 1.0 A  
F
Low Voltage Motor Control  
Power Management in Portable and BatteryPowered Products,  
1
2
8
7
i.e.: Computers, Printers, PCMCIA Cards, Cellular and Cordless Telephones  
A
A
S
G
C
C
D
D
MOSFET MAXIMUM RATINGS (T = 25°C unless otherwise noted).  
J
6
Rating  
Symbol Value  
Unit  
V
3
DraintoSource Voltage  
V
20  
DSS  
4
5
GatetoSource Voltage Continuous  
V
"20  
V
GS  
(TOP VIEW)  
Thermal Resistance −  
JunctiontoAmbient (Note 1)  
R
171  
0.73  
2.34  
1.87  
8.0  
°C/W  
W
q
P
D
D
D
JA  
MARKING DIAGRAM &  
PIN ASSIGNMENT  
Total Power Dissipation @ T = 25°C  
A
Continuous Drain Current @ T = 25°C  
I
A
A
Continuous Drain Current @ T = 70°C  
I
A
A
A
C
C
D
D
Pulsed Drain Current (Note 4)  
I
DM  
8
1
8
Thermal Resistance −  
E3P1xx  
AYWW G  
G
1
JunctiontoAmbient (Note 2)  
R
100  
1.25  
3.05  
2.44  
12  
°C/W  
W
q
P
JA  
D
D
D
Total Power Dissipation @ T = 25°C  
A
SO8  
Continuous Drain Current @ T = 25°C  
I
I
A
A
CASE 751  
STYLE 18  
Continuous Drain Current @ T = 70°C  
A
A
Pulsed Drain Current (Note 4)  
I
A
DM  
A
A
S
G
Thermal Resistance −  
E3P1 = Device Code  
JunctiontoAmbient (Note 3)  
R
q
62.5  
2.0  
3.86  
3.10  
15  
°C/W  
W
JA  
D
D
D
xx  
A
Y
WW  
G
= 02 or S  
= Assembly Location  
= Year  
= Work Week  
= PbFree Package  
Total Power Dissipation @ T = 25°C  
P
I
A
Continuous Drain Current @ T = 25°C  
A
A
Continuous Drain Current @ T = 70°C  
I
A
A
Pulsed Drain Current (Note 4)  
I
A
DM  
Operating and Storage Temperature Range  
T , T  
J
55 to  
+150  
°C  
stg  
(Note: Microdot may be in either location)  
Single Pulse DraintoSource Avalanche  
E
140  
mJ  
AS  
Energy Starting T = 25°C  
J
ORDERING INFORMATION  
(V = 20 Vdc, V = 4.5 Vdc,  
DD  
GS  
Peak I = 7.5 Apk, L = 5 mH, R = 25 W)  
L
G
Device  
Package  
Shipping  
Maximum Lead Temperature for Soldering  
T
260  
°C  
L
Purposes, 1/8from case for 10 seconds  
NTMSD3P102R2  
SO8  
2500/Tape & Reel  
2500/Tape & Reel  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Minimum FR4 or G10 PCB, Steady State.  
NTMSD3P102R2G  
SO8  
(PbFree)  
NTMSD3P102R2SG  
SO8  
(PbFree)  
2500/Tape & Reel  
2. Mounted onto a 2square FR4 Board (1 in sq, 2 oz Cu 0.06thick  
singlesided), Steady State.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
3. Mounted onto a 2square FR4 Board (1 in sq, 2 oz Cu 0.06thick single  
sided), t 10 seconds.  
4. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2%.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
March, 2006 Rev. 2  
NTMSD3P102R2/D  

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