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NTF2955T1G PDF预览

NTF2955T1G

更新时间: 2024-02-05 23:50:53
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管功率场效应晶体管开关脉冲光电二极管PC
页数 文件大小 规格书
5页 116K
描述
−60 V, −2.6 A, Single P−Channel SOT−223

NTF2955T1G 技术参数

是否无铅:不含铅生命周期:Active
零件包装代码:TO-261AA包装说明:TO-261, 4 PIN
针数:4Reach Compliance Code:not_compliant
ECCN代码:EAR99Factory Lead Time:1 week
风险等级:0.7Samacsys Confidence:3
Samacsys Status:Released2D Presentation:https://componentsearchengine.com/2D/0T/226810.1.2.png
Schematic Symbol:https://componentsearchengine.com/symbol.php?partID=226810PCB Footprint:https://componentsearchengine.com/footprint.php?partID=226810
3D View:https://componentsearchengine.com/viewer/3D.php?partID=226810Samacsys PartID:226810
Samacsys Image:https://componentsearchengine.com/Images/9/NTF2955T1G.jpgSamacsys Thumbnail Image:https://componentsearchengine.com/Thumbnails/1/NTF2955T1G.jpg
Samacsys Pin Count:4Samacsys Part Category:Transistor
Samacsys Package Category:SOT223 (3-Pin)Samacsys Footprint Name:SOT-223 ST SUFFIX CASE 318E-04 ISSUE N
Samacsys Released Date:2015-08-29 05:47:30Is Samacsys:N
雪崩能效等级(Eas):225 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):2.4 A最大漏极电流 (ID):1.7 A
最大漏源导通电阻:0.185 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-261AAJESD-30 代码:R-PDSO-G4
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:4
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):1.92 W
最大脉冲漏极电流 (IDM):10.4 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTF2955T1G 数据手册

 浏览型号NTF2955T1G的Datasheet PDF文件第2页浏览型号NTF2955T1G的Datasheet PDF文件第3页浏览型号NTF2955T1G的Datasheet PDF文件第4页浏览型号NTF2955T1G的Datasheet PDF文件第5页 
NTF2955, NVF2955,  
NVF2955P  
Power MOSFET  
60 V, 2.6 A, Single PChannel SOT223  
Features  
http://onsemi.com  
Design for low R  
DS(on)  
Withstands High Energy in Avalanche and Commutation Modes  
AECQ101 Qualified NVF2955, NVF2955P  
V
R
TYP  
I MAX  
D
(BR)DSS  
DS(on)  
60 V  
2.6 A  
145 mW @ 10 V  
These Devices are PbFree and are RoHS Compliant  
PChannel  
Applications  
Power Supplies  
PWM Motor Control  
Converters  
D
Power Management  
G
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
S
Parameter  
DraintoSource Voltage  
Symbol Value  
Unit  
V
60  
20  
V
MARKING DIAGRAMS AND  
DSS  
PIN ASSIGNMENT  
GatetoSource Voltage  
V
V
A
GS  
4 Drain  
Continuous Drain  
Current (Note 1)  
Steady T = 25°C  
State  
I
2.6  
2.0  
2.3  
A
D
T = 85°C  
A
AYW  
2955G  
G
Power Dissipation  
(Note 1)  
Steady T = 25°C  
State  
P
W
A
A
D
4
3
1
Gate  
Continuous Drain  
Current (Note 2)  
Steady T = 25°C  
State  
I
1.7  
1.3  
1.0  
2
A
D
Source  
1
2
Drain  
3
T = 85°C  
A
4 Drain  
SOT223  
CASE 318E  
STYLE 3  
Power Dissipation  
(Note 2)  
T = 25°C  
A
P
W
D
AYW  
2955PG  
G
Pulsed Drain Current  
tp = 10 ms  
I
17  
A
DM  
Operating Junction and Storage Temperature  
T ,  
55 to  
175  
°C  
J
3
1
Gate  
T
STG  
2
Source  
Drain  
Single Pulse DraintoSource Avalanche  
EAS  
225  
260  
mJ  
A
Y
W
G
= Assembly Location  
= Year  
= Work Week  
Energy (V = 25 V, V = 10 V, I = 6.7 A,  
DD  
G
PK  
L = 10 mH, R = 25 W)  
G
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 seconds)  
T
L
°C  
= PbFree Package  
(Note: Microdot may be in either location)  
THERMAL RESISTANCE RATINGS  
ORDERING INFORMATION  
Parameter  
Symbol  
Max  
Unit  
Device  
Package  
Shipping  
JunctiontoTab (Drain) Steady State (Note 2)  
R
14  
q
JC  
NTF2955T1G  
SOT223  
(PbFree)  
1000 /Tape & Reel  
JunctiontoAmbient Steady State (Note 1)  
JunctiontoAmbient Steady State (Note 2)  
R
65  
°C/W  
q
q
JA  
JA  
R
150  
NVF2955T1G  
SOT223  
(PbFree)  
1000/ Tape & Reel  
1000/ Tape & Reel  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
NVF2955PT1G  
SOT223  
(PbFree)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
1. When surface mounted to an FR4 board using 1 in. pad size (Cu. area = 1.127  
2
in [1 oz] including traces)  
2. When surface mounted to an FR4 board using the minimum recommended  
2
pad size (Cu. area = 0.341 in )  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
May, 2013 Rev. 6  
NTF2955/D  
 

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