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MIMXRT1011CAE4A

更新时间: 2024-11-18 15:19:03
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
65页 1276K
描述
i.MX RT1010 Crossover MCU with Arm® Cortex®-M7 Core Operating Up to ...

MIMXRT1011CAE4A 数据手册

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Document Number: IMXRT1010IEC  
Rev. 0, 09/2019  
NXP Semiconductors  
Data Sheet: Technical Data  
MIMXRT1011CAE4A  
i.MX RT1010 Crossover  
Processors Data Sheet  
for Industrial Products  
Package Information  
Plastic Package  
80-Pin LQFP, 12 x 12 mm, 0.5 mm pitch  
Ordering Information  
See Table 1 on page 4  
1 i.MX RT1010 introduction  
The i.MX RT1010 is a member of i.MX RT real-time  
1. i.MX RT1010 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 4  
2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
3.1. Special signal considerations . . . . . . . . . . . . . . . 12  
3.2. Recommended connections for unused analog  
®
®
processor family based on the Arm Cortex -M7 core,  
which operates at speeds up to 400 MHz to provide high  
CPU performance and best real-time response.  
The i.MX RT1010 processor has 128 KB on-chip RAM,  
which can be flexibly configured as TCM or  
interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 15  
4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 15  
4.2. System power and clocks . . . . . . . . . . . . . . . . . . 21  
4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 30  
4.5. External memory interface . . . . . . . . . . . . . . . . . 34  
4.6. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40  
4.7. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43  
4.8. Communication interfaces . . . . . . . . . . . . . . . . . . 49  
4.9. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54  
5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 55  
5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 55  
5.2. Boot device interface allocation . . . . . . . . . . . . . . 55  
6. Package information and contact assignments . . . . . . . 57  
6.1. 12 x 12 mm package information . . . . . . . . . . . . 57  
7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64  
general-purpose on-chip RAM. The i.MX RT1010  
integrates advanced power management module with  
DCDC and LDO that reduces complexity of external  
power supply and simplifies power sequencing. The  
i.MX RT1010 also provides various memory interfaces,  
including Quad SPI, and a wide range of connectivity  
interfaces, including UART, SPI, I2C, and USB; for  
connecting peripherals including WLAN, Bluetooth™,  
and GPS. The i.MX RT1010 also has rich audio features,  
including SPDIF and I2S audio interface. Various analog  
IP integration, including ADC, temperature sensor, and  
etc.  
NXP reserves the right to change the production detail specifications as may be required  
to permit improvements in the design of its products.  

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