Document Number: IMXRT1010IEC
Rev. 0, 09/2019
NXP Semiconductors
Data Sheet: Technical Data
MIMXRT1011CAE4A
i.MX RT1010 Crossover
Processors Data Sheet
for Industrial Products
Package Information
Plastic Package
80-Pin LQFP, 12 x 12 mm, 0.5 mm pitch
Ordering Information
See Table 1 on page 4
1 i.MX RT1010 introduction
The i.MX RT1010 is a member of i.MX RT real-time
1. i.MX RT1010 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 4
2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1. Special signal considerations . . . . . . . . . . . . . . . 12
3.2. Recommended connections for unused analog
®
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processor family based on the Arm Cortex -M7 core,
which operates at speeds up to 400 MHz to provide high
CPU performance and best real-time response.
The i.MX RT1010 processor has 128 KB on-chip RAM,
which can be flexibly configured as TCM or
interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 15
4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 15
4.2. System power and clocks . . . . . . . . . . . . . . . . . . 21
4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.5. External memory interface . . . . . . . . . . . . . . . . . 34
4.6. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
4.7. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
4.8. Communication interfaces . . . . . . . . . . . . . . . . . . 49
4.9. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 55
5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 55
5.2. Boot device interface allocation . . . . . . . . . . . . . . 55
6. Package information and contact assignments . . . . . . . 57
6.1. 12 x 12 mm package information . . . . . . . . . . . . 57
7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
general-purpose on-chip RAM. The i.MX RT1010
integrates advanced power management module with
DCDC and LDO that reduces complexity of external
power supply and simplifies power sequencing. The
i.MX RT1010 also provides various memory interfaces,
including Quad SPI, and a wide range of connectivity
interfaces, including UART, SPI, I2C, and USB; for
connecting peripherals including WLAN, Bluetooth™,
and GPS. The i.MX RT1010 also has rich audio features,
including SPDIF and I2S audio interface. Various analog
IP integration, including ADC, temperature sensor, and
etc.
NXP reserves the right to change the production detail specifications as may be required
to permit improvements in the design of its products.