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NTD4969NT4G PDF预览

NTD4969NT4G

更新时间: 2024-11-09 10:30:31
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 114K
描述
Power MOSFET 30 V, 41 A, Single N?Channel, DPAK/IPAK CPU Power Delivery

NTD4969NT4G 技术参数

是否无铅: 不含铅生命周期:Lifetime Buy
包装说明:SMALL OUTLINE, R-PSSO-G2针数:4
Reach Compliance Code:not_compliantECCN代码:EAR99
风险等级:1.49雪崩能效等级(Eas):15 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):41 A
最大漏极电流 (ID):9.4 A最大漏源导通电阻:0.019 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):26.3 W
最大脉冲漏极电流 (IDM):150 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTD4969NT4G 数据手册

 浏览型号NTD4969NT4G的Datasheet PDF文件第2页浏览型号NTD4969NT4G的Datasheet PDF文件第3页浏览型号NTD4969NT4G的Datasheet PDF文件第4页浏览型号NTD4969NT4G的Datasheet PDF文件第5页浏览型号NTD4969NT4G的Datasheet PDF文件第6页浏览型号NTD4969NT4G的Datasheet PDF文件第7页 
NTD4969N  
Power MOSFET  
30 V, 41 A, Single NChannel, DPAK/IPAK  
Features  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Capacitance to Minimize Driver Losses  
Optimized Gate Charge to Minimize Switching Losses  
Three Package Variations for Design Flexibility  
http://onsemi.com  
V
R
MAX  
I
D
MAX  
(BR)DSS  
DS(ON)  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
9.0 mW @ 10 V  
19 mW @ 4.5 V  
Compliant  
30 V  
41 A  
Applications  
CPU Power Delivery  
DCDC Converters  
D
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
DraintoSource Voltage  
GatetoSource Voltage  
Symbol  
Value  
30  
Unit  
G
V
DSS  
V
V
A
V
GS  
20  
S
Continuous Drain  
Current R  
I
D
T = 25°C  
12.7  
A
NCHANNEL MOSFET  
q
JA  
T = 100°C  
A
9.0  
(Note 1)  
Power Dissipation  
(Note 1)  
4
T = 25°C  
A
P
2.56  
W
A
4
D
D
D
R
q
JA  
4
Continuous Drain  
Current R  
I
D
T = 25°C  
A
9.4  
6.6  
q
JA  
T = 100°C  
A
Steady  
State  
2
(Note 2)  
Power Dissipation  
(Note 2)  
1
1
1
2
3
3
T = 25°C  
A
P
I
1.38  
W
A
2
3
R
q
JA  
CASE 369AC  
3 IPAK  
(Straight Lead)  
CASE 369AA  
DPAK  
(Bent Lead)  
STYLE 2  
CASE 369D  
IPAK  
(Straight Lead  
DPAK)  
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
41  
29  
D
C
q
JC  
T
C
(Note 1)  
Power Dissipation  
(Note 1)  
T
C
P
26.3  
W
A
R
q
JC  
MARKING DIAGRAMS  
& PIN ASSIGNMENTS  
Pulsed Drain  
Current  
t =10ms  
p
T = 25°C  
A
I
DM  
150  
40  
4
Current Limited by Package  
T = 25°C  
A
I
A
DmaxPkg  
Drain  
4
4
Operating Junction and Storage  
Temperature  
T ,  
55 to  
+175  
°C  
J
Drain  
Drain  
T
STG  
Source Current (Body Diode)  
Drain to Source dV/dt  
I
24  
6.0  
18  
A
S
dV/dt  
EAS  
V/ns  
mJ  
Single Pulse DraintoSource Avalanche  
Energy (T = 25°C, V = 24 V, V = 10 V,  
J
DD  
GS  
I = 19 A , L = 0.1 mH, R = 25 W)  
2
L
pk  
G
1
2
3
Drain  
1
3
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
T
260  
°C  
L
Gate Drain Source  
Gate Source  
1
2
3
Gate Drain Source  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu.  
2. Surfacemounted on FR4 board using the minimum recommended pad size.  
Y
WW  
= Year  
= Work Week  
4969N = Device Code  
= PbFree Package  
G
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 3 of this data sheet.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
April, 2011 Rev. 1  
NTD4969N/D  
 

NTD4969NT4G 替代型号

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NTD4858NT4G ONSEMI

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