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NTB10N60T4 PDF预览

NTB10N60T4

更新时间: 2024-11-02 15:46:55
品牌 Logo 应用领域
安森美 - ONSEMI 开关脉冲晶体管
页数 文件大小 规格书
8页 67K
描述
10A, 600V, 0.75ohm, N-CHANNEL, Si, POWER, MOSFET, D2PAK-3

NTB10N60T4 技术参数

是否Rohs认证:不符合生命周期:Obsolete
包装说明:D2PAK-3针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
风险等级:5.36Is Samacsys:N
雪崩能效等级(Eas):500 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:600 V
最大漏极电流 (Abs) (ID):10 A最大漏极电流 (ID):10 A
最大漏源导通电阻:0.75 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e0
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):201 W
最大脉冲漏极电流 (IDM):35 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTB10N60T4 数据手册

 浏览型号NTB10N60T4的Datasheet PDF文件第2页浏览型号NTB10N60T4的Datasheet PDF文件第3页浏览型号NTB10N60T4的Datasheet PDF文件第4页浏览型号NTB10N60T4的Datasheet PDF文件第5页浏览型号NTB10N60T4的Datasheet PDF文件第6页浏览型号NTB10N60T4的Datasheet PDF文件第7页 
NTP10N60, NTB10N60  
Preferred Devices  
Advance Information  
Power MOSFET  
10 Amps, 600 Volts  
N–Channel TO–220 and D2PAK  
http://onsemi.com  
Designed for high voltage, high speed switching applications in  
power supplies, converters, power motor controls and bridge circuits.  
10 AMPERES  
600 VOLTS  
RDS(on) = 0.75  
Features  
Higher Current Rating  
Lower R  
Lower Capacitances  
DS(on)  
Lower Total Gate Charge  
N–Channel  
D
Tighter V Specifications  
SD  
Avalanche Energy Specified  
Typical Applications  
Switch Mode Power Supplies  
PWM Motor Controls  
Converters  
G
4
S
Bridge Circuits  
4
1
2
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
3
Rating  
Symbol  
Value  
600  
Unit  
Vdc  
Vdc  
Vdc  
2
D PAK  
CASE 418B  
STYLE 2  
TO–220AB  
CASE 221A  
STYLE 5  
Drain–Source Voltage  
V
DSS  
DGR  
Drain–Gate Voltage (R = 1.0 M)  
V
600  
GS  
1
2
Gate–Source Voltage  
– Continuous  
3
MARKING DIAGRAMS  
AND PIN ASSIGNMENTS  
V
GS  
"20  
"40  
– Non–Repetitive (t v10 ms)  
V
GSM  
p
Drain  
Drain  
DrainContinuous  
I
I
10  
8.0  
35  
Adc  
D
– Continuous @ 100°C  
– Single Pulse (t v10 µs)  
D
I
DM  
p
NTB10N60  
LLYWW  
Total Power Dissipation  
Derate above 25°C  
P
201  
1.61  
Watts  
W/°C  
D
NTP10N60  
LLYWW  
Operating and Storage  
Temperature Range  
T , T  
J
–55 to  
+150  
°C  
stg  
Drain  
Gate  
Source  
Gate  
Source  
Single Drain–to–Source Avalanche  
E
AS  
500  
mJ  
Energy – Starting T = 25°C  
J
NTx10N60 = Device Code  
(V = 100 V, V = 10 Vdc,  
DD  
GS  
Drain  
LL  
= Location Code  
= Year  
I = 10 A, L = 10 mH, R = 25 )  
L
G
Y
WW  
= Work Week  
Thermal Resistance  
°C/W  
°C  
– Junction–to–Case  
– Junction–to–Ambient  
– Junction–to–Ambient (Note 1.)  
R
R
R
0.62  
62.5  
50  
θ
JC  
JA  
JA  
θ
θ
ORDERING INFORMATION  
Device  
Package  
Shipping  
Maximum Lead Temperature for  
Soldering Purposes, 1/8from case  
for 10 seconds  
T
260  
L
NTP10N60  
NTB10N60  
NTB10N60T4  
TO–220AB  
50 Units/Rail  
50 Units/Rail  
2
D PAK  
1. When surface mounted to an FR4 board using the minimum recommended  
pad size.  
2
D PAK  
800/Tape & Reel  
This document contains information on a new product. Specifications and information  
herein are subject to change without notice.  
Preferred devices are recommended choices for future use  
and best overall value.  
Semiconductor Components Industries, LLC, 2000  
1
Publication Order Number:  
November, 2000 – Rev. 1  
NTP10N60/D  

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